購買 TC58NVG2S0HBAI4與BYCHPS
購買即有保證
TC58NVG2S0HBAI4
- 型號:
- TC58NVG2S0HBAI4
- 描述:
- IC EEPROM 4GBIT 25NS 63TFBGA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17915 Pieces
簡單介紹
BYCHIPS是 TC58NVG2S0HBAI4的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的TC58NVG2S0HBAI4購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 2.7 V ~ 3.6 V |
|---|---|
| 供應商設備封裝: | 63-TFBGA (9x11) |
| 速度: | 25ns |
| 系列: | - |
| 封装: | Tray |
| 封裝/箱體: | 63-VFBGA |
| 其他名稱: | TC58NVG2S0HBAI4JDH TC58NVG2S0HBAI4YCL TC58NVG2S0HBIAJDH |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 內存類型: | Non-Volatile |
| 內存大小: | 4Gb (512M x 8) |
| 內存格式: | EEPROM |
| 製造商零件編號: | TC58NVG2S0HBAI4 |
| 接口: | Parallel |
| 描述: | IC EEPROM 4GBIT 25NS 63TFBGA |
| Email: | [email protected] |
TC58NVG2S0HBAI4的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers