購買 T550B107M060BH4252與BYCHPS
購買即有保證
T550B107M060BH4252
- 型號:
- T550B107M060BH4252
- 製造商:
- KEMET
- 描述:
- CAP TANT POLY 100UF 60V AXIAL
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 15201 Pieces
簡單介紹
BYCHIPS是 T550B107M060BH4252的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的T550B107M060BH4252購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 60V |
|---|---|
| 類型: | Hermetically Sealed |
| 公差: | ±20% |
| 尺寸/尺寸: | 0.279" Dia x 0.650" L (7.09mm x 16.51mm) |
| 系列: | T550 |
| 封装: | Tray |
| 封裝/箱體: | Axial |
| 工作溫度: | -55°C ~ 105°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商尺寸代碼: | B |
| 製造商零件編號: | T550B107M060BH4252 |
| 壽命@溫度。: | 2000 Hrs @ 105°C |
| 引線間距: | - |
| 高度 - 座高（最大）: | - |
| 特徵: | General Purpose |
| 展開說明: | 100µF ±20% Hermetically Sealed Tantalum Polymer Capacitor 60V Axial 100 mOhm |
| ESR（等效串聯電阻）: | 100 mOhm |
| 描述: | CAP TANT POLY 100UF 60V AXIAL |
| 電容: | 100µF |
| Email: | [email protected] |
T550B107M060BH4252的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
T550B107M060BH42510100 | KEMET | CAP TANT POLY 100UF 60V AXIAL | 在線詢價 |
|
T550B107M060BH | KEMET | CAP TANT POLY 100UF 60V AXIAL | 在線詢價 |
|
T550B107M060BH4251 | KEMET | CAP TANT POLY 100UF 60V AXIAL | 在線詢價 |
 |
T550B107M060TH4252 | KEMET | CAP TANT POLY 100UF 60V AXIAL | 在線詢價 |
|
T550B107M060AH42510100 | KEMET | CAP TANT POLY 100UF 60V AXIAL | 在線詢價 |
 |
T550B107M060AH4251 | KEMET | CAP TANT POLY 100UF 60V AXIAL | 在線詢價 |
|
T550B107M060TH42520100 | KEMET | CAP TANT POLY 100UF 60V AXIAL | 在線詢價 |
|
T550B107M060AH | KEMET | CAP TANT POLY 100UF 60V AXIAL | 在線詢價 |
|
T550B107M060BH42520100 | KEMET | CAP TANT POLY 100UF 60V AXIAL | 在線詢價 |
|
T550B107M060AT0100 | KEMET | CAP TANT POLY 100UF 60V AXIAL | 在線詢價 |
|
T550B107M060AH42520100 | KEMET | CAP TANT POLY 100UF 60V AXIAL | 在線詢價 |
|
T550B107M060AT4251 | KEMET | CAP TANT POLY 100UF 60V AXIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers