購買 ST30002B與BYCHPS
購買即有保證
ST30002B
- 型號:
- ST30002B
- 製造商:
- U.S. Sensor
- 描述:
- ICL 30 OHM 20% 2A 13.97MM
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12835 Pieces
- 數據表:
- ST30002B.pdf
簡單介紹
BYCHIPS是 ST30002B的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的ST30002B購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 公差: | ±20% |
|---|---|
| 系列: | ST |
| - [R @電流: | 0.70 Ohm |
| R @ 25°C: | 30 Ohm |
| 封装: | Bulk |
| 製造商零件編號: | ST30002B |
| 引線間距: | 0.200" (5.08mm) |
| 展開說明: | Inrush Current Limiter 30 Ohm Ohm ±20% 0.550" (13.97mm) |
| 直徑: | 0.550" (13.97mm) |
| 描述: | ICL 30 OHM 20% 2A 13.97MM |
| 電流 - 穩態最大值: | 2A |
| 認證: | - |
| Email: | [email protected] |
ST30002B的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
B57211P200M351 | EPCOS (TDK) | ICL 20 OHM 20% 3A 13MM | 在線詢價 |
 |
ST30003B | US Sensor | ICL 30 OHM 20% 3A 17.78MM | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers