購買 SOMOMAP3530-11-1782JFIR與BYCHPS
購買即有保證
SOMOMAP3530-11-1782JFIR
- 型號:
- SOMOMAP3530-11-1782JFIR
- 製造商:
- Logic PD, Inc.
- 描述:
- SYSTEM ON MODULE LV OMAP3530
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12544 Pieces
簡單介紹
BYCHIPS是 SOMOMAP3530-11-1782JFIR的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的SOMOMAP3530-11-1782JFIR購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 速度: | 600MHz |
|---|---|
| 尺寸/尺寸: | 1.23" x 3.01" (31.2mm x 76.5mm) |
| 系列: | OMAP35x |
| RAM容量: | 256MB |
| 其他名稱: | 1023805 SOMOMAP3530-11-1782JFIR-D SOMOMAP3530-11-1782JFIR-E SOMOMAP3530-11-1782JFIR-ND SOMOMAP3530111782JFIR |
| 工作溫度: | -40°C ~ 85°C |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 模塊/板類型: | MPU, DSP Core |
| 製造商標準交貨期: | 12 Weeks |
| 製造商零件編號: | SOMOMAP3530-11-1782JFIR |
| 閃存大小: | 512MB (NAND), 8MB (NOR) |
| 展開說明: | OMAP35x Embedded Module ARM® Cortex®-A8, OMAP3530 TMS320C64x (DSP) 600MHz 256MB 512MB (NAND), 8MB (NOR) |
| 描述: | SYSTEM ON MODULE LV OMAP3530 |
| 核心處理器: | ARM® Cortex®-A8, OMAP3530 |
| 連接器類型: | Board-to-Board (BTB) Socket - 240 |
| 協處理器: | TMS320C64x (DSP) |
| Email: | [email protected] |
SOMOMAP3530-11-1782JFIR的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
SOMOMAP3530-10-1672IFCR | Logic | SYSTEM ON MODULE LV OMAP3530 | 在線詢價 |
 |
SOMOMAP3530-21-1780AGIR | Logic | SYSTEM ON MODULE LV OMAP3530 | 在線詢價 |
 |
SOMOMAP3530-11-1782IFXR | Logic | SOM OMAP3530 SOM-LV TY | 在線詢價 |
 |
SOMOMAP3530-11-1672IFCR | Logic | SYSTEM ON MODULE LV OMAP3530 | 在線詢價 |
 |
SOMOMAP3530-11-1670EFCR | Logic | SYSTEM ON MODULE LV OMAP3530 | 在線詢價 |
|
SOMOMAP3530-11-1672IFXR | Logic | SYSTEM ON MODULE LV OMAP3530 | 在線詢價 |
|
SOMOMAP3530-10-1670EFCR | Logic | SYSTEM ON MODULE LV OMAP3530 | 在線詢價 |
 |
SOMOMAP3530-21-1670AGCR | Logic | SYSTEM ON MODULE LV OMAP3530 | 在線詢價 |
|
SOMOMAP3530-10-1672IFXR | Logic | SYSTEM ON MODULE LV OMAP3530 | 在線詢價 |
|
SOMOMAP3530-20-1670AGIR | Logic | SYSTEM ON MODULE LV OMAP3530 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers