購買 SLE5542M32XHSA2與BYCHPS
購買即有保證
SLE5542M32XHSA2
- 型號:
- SLE5542M32XHSA2
- 描述:
- IC MEMORY
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15481 Pieces
簡單介紹
BYCHIPS是 SLE5542M32XHSA2的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的SLE5542M32XHSA2購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Memory |
|---|---|
| 供應商設備封裝: | Module |
| 系列: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | Module |
| 其他名稱: | SLE 5542 M3.2 SLE 5542 M3.2TR SLE 5542 M3.2TR-ND |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | SLE5542M32XHSA2 |
| 展開說明: | Memory IC Security Module |
| 描述: | IC MEMORY |
| 應用: | Security |
| Email: | [email protected] |
SLE5542M32XHSA2的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
DS34T104GN+ | Maxim Integrated | IC TDM OVER PACKET 484BGA | 在線詢價 |
 |
IDT72P51749L6BB8 | IDT, Integrated Device Technology Inc | IC FLOW CTRL 36BIT 256-BGA | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog