購買 RS61C101MCS1與BYCHPS
購買即有保證
RS61C101MCS1
- 型號:
- RS61C101MCS1
- 製造商:
- Nichicon
- 描述:
- CAP ALUM POLY 100UF 20% 16V T/H
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15972 Pieces
簡單介紹
BYCHIPS是 RS61C101MCS1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的RS61C101MCS1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 16V |
|---|---|
| 類型: | Polymer |
| 公差: | ±20% |
| 表面貼裝佔地面積: | - |
| 尺寸/尺寸: | 0.248" Dia (6.30mm) |
| 系列: | FPCAP, RS6 |
| 波紋電流 - 低頻: | 249mA @ 120Hz |
| 紋波電流 - 高頻: | 2.49A @ 100kHz |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Can |
| 工作溫度: | -55°C ~ 105°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 18 Weeks |
| 製造商零件編號: | RS61C101MCS1 |
| 壽命@溫度。: | 2000 Hrs @ 105°C |
| 引線間距: | 0.098" (2.50mm) |
| 阻抗: | - |
| 高度 - 座高（最大）: | 0.276" (7.00mm) |
| 展開說明: | 100µF ±20% 16V Aluminum Polymer Capacitor Radial, Can 24 mOhm 2000 Hrs @ 105°C |
| ESR（等效串聯電阻）: | 24 mOhm |
| 描述: | CAP ALUM POLY 100UF 20% 16V T/H |
| 電容: | 100µF |
| 應用: | - |
| Email: | [email protected] |
RS61C101MCS1的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
RS61C101MDS1 | Nichicon | CAP ALUM POLY 100UF 20% 16V T/H | 在線詢價 |
 |
RS61C101MDS1JT | Nichicon | CAP ALUM POLY 100UF 20% 16V T/H | 在線詢價 |
|
RS61C101MCS1JT | Nichicon | CAP ALUM POLY 100UF 20% 16V T/H | 在線詢價 |
 |
PCR1H121MCL2GS | Nichicon | CAP ALUM POLY 120UF 20% 50V SMD | 在線詢價 |
 |
RS80E821MDN1PX | Nichicon | CAP ALUM POLY 820UF 20% 2.5V T/H | 在線詢價 |
 |
16SVPS100M | Panasonic Electronic Components | CAP ALUM POLY 100UF 20% 16V SMD | 在線詢價 |
 |
EEF-CD0J680R | Panasonic Electronic Components | CAP ALUM POLY 68UF 20% 6.3V SMD | 在線詢價 |
 |
HHXA350ARA680MF80G | United Chemi-Con | CAP ALUM POLY HYB 68UF 35V SMD | 在線詢價 |
 |
870025174001 | Wurth Electronics Inc. | CAP ALUM POLY 180UF 20% 6.3V T/H | 在線詢價 |
 |
RNE1A221MDS1JX | Nichicon | CAP ALUM POLY 220UF 20% 10V T/H | 在線詢價 |
 |
875075555004 | Wurth Electronics Inc. | CAP ALUM POLY 82UF 20% 25V SMD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers