購買 RHEL81H472K1A2A03B與BYCHPS
購買即有保證
RHEL81H472K1A2A03B
- 型號:
- RHEL81H472K1A2A03B
- 描述:
- CAP CER 4700PF 50V X8L RADIAL
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16991 Pieces
簡單介紹
BYCHIPS是 RHEL81H472K1A2A03B的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的RHEL81H472K1A2A03B購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 50V |
|---|---|
| 公差: | ±10% |
| 厚度（最大）: | - |
| 溫度係數: | X8L |
| 尺寸/尺寸: | 0.157" L x 0.098" W (4.00mm x 2.50mm) |
| 系列: | RH |
| 評級: | AEC-Q200 |
| 封装: | Bulk |
| 封裝/箱體: | Radial |
| 工作溫度: | -55°C ~ 150°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 11 Weeks |
| 製造商零件編號: | RHEL81H472K1A2A03B |
| 引線型: | Straight |
| 引線間距: | 0.098" (2.50mm) |
| 高度 - 座高（最大）: | 0.197" (5.00mm) |
| 特徵: | - |
| 展開說明: | 4700pF ±10% 50V Ceramic Capacitor X8L Radial |
| 描述: | CAP CER 4700PF 50V X8L RADIAL |
| 電容: | 4700pF |
| 應用: | Automotive |
| Email: | [email protected] |
RHEL81H472K1A2A03B的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
RHEL81H473K1DBA03A | Murata Electronics North America | CAP CER 0.047UF 50V X8L RADIAL | 在線詢價 |
|
RHEL81H472K1DBA03A | Murata Electronics North America | CAP CER 4700PF 50V X8L RADIAL | 在線詢價 |
 |
RHEL81H472K1K1A03B | Murata Electronics North America | CAP CER 4700PF 50V X8L RADIAL | 在線詢價 |
|
RHEL81H473K1A2A03B | Murata Electronics North America | CAP CER 0.047UF 50V X8L RADIAL | 在線詢價 |
|
RHEL81H472K1M1A03A | Murata Electronics North America | CAP CER 4700PF 50V X8L RADIAL | 在線詢價 |
|
RHEL81H473K1M1A03A | Murata Electronics North America | CAP CER 0.047UF 50V X8L RADIAL | 在線詢價 |
|
RHEL81H473K1K1A03B | Murata Electronics North America | CAP CER 0.047UF 50V X8L RADIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers