購買 PVG613S與BYCHPS
購買即有保證
PVG613S
- 型號:
- PVG613S
- 描述:
- IC RELAY PHOTOVO 60V 1A 6-SMD
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 19327 Pieces
- 數據表:
- PVG613S.pdf
簡單介紹
BYCHIPS是 PVG613S的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的PVG613S購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 負載: | 0 ~ 60 V |
|---|---|
| 電壓 - 輸入: | 1.2VDC |
| 端接類型: | Gull Wing |
| 供應商設備封裝: | 6-SMT |
| 系列: | PVG, HEXFET® |
| 繼電器類型: | Relay |
| 封装: | Tube |
| 封裝/箱體: | 6-SMD (0.300", 7.62mm) |
| 輸出類型: | AC, DC |
| 其他名稱: | *PVG613S |
| 通態電阻（最大值）: | 500 mOhm |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 4 (72 Hours) |
| 製造商零件編號: | PVG613S |
| 負載電流: | 1A |
| 展開說明: | Solid State Relay SPST-NO (1 Form A) 6-SMD (0.300", 7.62mm) |
| 描述: | IC RELAY PHOTOVO 60V 1A 6-SMD |
| 電路: | SPST-NO (1 Form A) |
| Email: | [email protected] |
PVG613S的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers