購買 PQ1CG3032RZH與BYCHPS
購買即有保證
PQ1CG3032RZH
- 型號:
- PQ1CG3032RZH
- 描述:
- IC REG BUCK INV ADJ 3.5A TO220
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14443 Pieces
- 數據表:
- PQ1CG3032RZH.pdf
簡單介紹
BYCHIPS是 PQ1CG3032RZH的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的PQ1CG3032RZH購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 輸出（最小/固定）: | ±1.26V |
|---|---|
| 電壓 - 輸出（最大）: | 35V, -30V |
| 電壓 - 輸入（最小值）: | 8V |
| 電壓 - 輸入（最大）: | 35V |
| 拓撲: | Buck |
| 同步整流: | No |
| 供應商設備封裝: | TO-220-5 |
| 系列: | - |
| 封装: | Tube |
| 封裝/箱體: | TO-220-5 Formed Leads |
| 輸出類型: | Adjustable |
| 輸出配置: | Positive or Negative |
| 其他名稱: | 425-2298-5 |
| 工作溫度: | -20°C ~ 80°C (TA) |
| 輸出端數量: | 1 |
| 安裝類型: | Through Hole |
| 製造商零件編號: | PQ1CG3032RZH |
| 功能: | Step-Down |
| 頻率 - 開關: | 150kHz |
| 展開說明: | Buck Switching Regulator IC Positive or Negative Adjustable ±1.26V 1 Output 3.5A TO-220-5 Formed Leads |
| 描述: | IC REG BUCK INV ADJ 3.5A TO220 |
| 電流 - 輸出: | 3.5A |
| Email: | [email protected] |
PQ1CG3032RZH的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
PQ1CG21H2RZ | Sharp Microelectronics | IC REG BUCK INV ADJ 1.5A TO220 | 在線詢價 |
 |
PQ1CG3032FZ | Sharp Microelectronics | IC REG BUCK INV ADJ 3.5A TO220 | 在線詢價 |
 |
PQ1CG41H2RZH | Sharp Microelectronics | IC REG BUCK INV ADJ 1.5A TO220 | 在線詢價 |
 |
PQ1CG3032RZ | Sharp Microelectronics | IC REG BUCK INV ADJ 3.5A TO220 | 在線詢價 |
 |
PQ1CG2032RZ | Sharp Microelectronics | IC REG BUCK INV ADJ 3.5A TO220 | 在線詢價 |
 |
PQ1CG38M2RZ | Sharp Microelectronics | IC REG BUCK INV ADJ 0.8A TO220 | 在線詢價 |
 |
PQ1CG3032FZH | Sharp Microelectronics | IC REG BUCK INV ADJ 3.5A TO220 | 在線詢價 |
 |
PQ1CG38M2FZ | Sharp Microelectronics | IC REG BUCK INV ADJ 0.8A TO220 | 在線詢價 |
|
PQ1CG38M2RZH | Sharp Microelectronics | IC REG BUCK INV ADJ 0.8A TO220 | 在線詢價 |
|
PQ1CG41H2FZH | Sharp Microelectronics | IC REG BUCK INV ADJ 1.5A TO220 | 在線詢價 |
 |
PQ1CG38M2FZH | Sharp Microelectronics | IC REG BUCK INV ADJ 0.8A TO220 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers