購買 NTSB30120CTT4G與BYCHPS
購買即有保證
NTSB30120CTT4G
- 型號:
- NTSB30120CTT4G
- 描述:
- DIODE ARRAY SCHOTTKY 120V D2PAK
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19195 Pieces
簡單介紹
BYCHIPS是 NTSB30120CTT4G的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的NTSB30120CTT4G購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 正向（Vf）（最大）: | 1.08V @ 15A |
|---|---|
| 電壓 - （Vr）（最大）: | 120V |
| 供應商設備封裝: | D2PAK-3 |
| 速度: | Fast Recovery = 200mA (Io) |
| 系列: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| 其他名稱: | NTSB30120CTT4GOSTR |
| 工作溫度 - 結: | -40°C ~ 150°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 28 Weeks |
| 製造商零件編號: | NTSB30120CTT4G |
| 展開說明: | Diode Array 1 Pair Common Cathode Schottky 120V 15A Surface Mount TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| 二極管類型: | Schottky |
| 二極管配置: | 1 Pair Common Cathode |
| 描述: | DIODE ARRAY SCHOTTKY 120V D2PAK |
| 電流 - Vr時反向漏電: | 800µA @ 120V |
| 電流 - 平均整流（Io）（每二極管）: | 15A |
| Email: | [email protected] |
NTSB30120CTT4G的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
NTSB30120CTG | ON Semiconductor | DIODE ARRAY SCHOTTKY 120V D2PAK | 在線詢價 |
 |
NTSB30100CT-1G | ON Semiconductor | DIODE ARRAY SCHOTTKY 100V I2PAK | 在線詢價 |
 |
NTSB30120CT-1G | ON Semiconductor | DIODE ARRAY SCHOTTKY 120V I2PAK | 在線詢價 |
|
NTSB30100CTT4G | ON Semiconductor | DIODE ARRAY SCHOTTKY 100V D2PAK | 在線詢價 |
|
NTSB30100S-1G | ON Semiconductor | DIODE SCHOTTKY 100V 30A I2PAK | 在線詢價 |
|
NTSB30U100CTG | ON Semiconductor | DIODE SCHOTTKY 30A 100V D2PAK | 在線詢價 |
|
NTSB30100CTG | ON Semiconductor | DIODE ARRAY SCHOTTKY 100V D2PAK | 在線詢價 |
|
NTSB30U100CT-1G | ON Semiconductor | DIODE ARRAY SCHOTTKY 100V I2PAK | 在線詢價 |
|
NTSB30U100CTT4G | ON Semiconductor | DIODE SCHOTTKY 30A 100V D2PAK | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers