購買 NTJD4158CT1G與BYCHPS
購買即有保證
NTJD4158CT1G
- 型號:
- NTJD4158CT1G
- 描述:
- MOSFET N/P-CH 30V/20V SOT-363
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14169 Pieces
- 數據表:
- NTJD4158CT1G.pdf
簡單介紹
BYCHIPS是 NTJD4158CT1G的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的NTJD4158CT1G購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| VGS（TH）（最大）@標識: | 1.5V @ 100µA |
|---|---|
| 供應商設備封裝: | SC-88/SC70-6/SOT-363 |
| 系列: | - |
| RDS（ON）（最大值）@標識，柵極電壓: | 1.5 Ohm @ 10mA, 4.5V |
| 功率 - 最大: | 270mW |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 6-TSSOP, SC-88, SOT-363 |
| 其他名稱: | NTJD4158CT1G-ND NTJD4158CT1GOSTR |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 26 Weeks |
| 製造商零件編號: | NTJD4158CT1G |
| 輸入電容（Ciss）（Max）@ Vds: | 33pF @ 5V |
| 柵極電荷（Qg）（Max）@ Vgs: | 1.5nC @ 5V |
| FET型: | N and P-Channel |
| FET特點: | Logic Level Gate |
| 展開說明: | Mosfet Array N and P-Channel 30V, 20V 250mA, 880mA 270mW Surface Mount SC-88/SC70-6/SOT-363 |
| 漏極至源極電壓（Vdss）: | 30V, 20V |
| 描述: | MOSFET N/P-CH 30V/20V SOT-363 |
| 電流 - 25°C連續排水（Id）: | 250mA, 880mA |
| Email: | [email protected] |
NTJD4158CT1G的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
NTJD4152PT1 | ON Semiconductor | MOSFET 2P-CH 20V 0.88A SOT-363 | 在線詢價 |
|
NTJD4158CT2G | ON Semiconductor | MOSFET N/P-CH 30V/20V SC88-6 | 在線詢價 |
|
NTJD4105CT1G | ON Semiconductor | MOSFET N/P-CH 20V/8V SOT-363 | 在線詢價 |
|
NTJD4105CT2 | ON Semiconductor | MOSFET N/P-CH 20V/8V SOT-363 | 在線詢價 |
|
NTJD4152PT1G | ON Semiconductor | MOSFET 2P-CH 20V 0.88A SOT-363 | 在線詢價 |
|
NTJD4152PT2G | ON Semiconductor | MOSFET 2P-CH 20V 0.88A SC88-6 | 在線詢價 |
|
NTJD4105CT4G | ON Semiconductor | MOSFET N/P-CH 20V/8V SOT-363 | 在線詢價 |
|
NTJD4401NT1G | ON Semiconductor | MOSFET 2N-CH 20V 0.63A SOT-363 | 在線詢價 |
|
NTJD4105CT4 | ON Semiconductor | MOSFET N/P-CH 20V/8V SOT-363 | 在線詢價 |
|
NTJD4001NT1G | ON Semiconductor | MOSFET 2N-CH 30V 0.25A SOT-363 | 在線詢價 |
|
NTJD4105CT2G | ON Semiconductor | MOSFET N/P-CH 20V/8V SOT-363 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers