購買 NTD3055L170-001與BYCHPS
購買即有保證
NTD3055L170-001
- 型號:
- NTD3055L170-001
- 描述:
- MOSFET N-CH 60V 9A IPAK
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 13298 Pieces
簡單介紹
BYCHIPS是 NTD3055L170-001的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的NTD3055L170-001購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| VGS（TH）（最大）@標識: | 2V @ 250µA |
|---|---|
| 技術: | MOSFET (Metal Oxide) |
| 供應商設備封裝: | I-Pak |
| 系列: | - |
| RDS（ON）（最大值）@標識，柵極電壓: | 170 mOhm @ 4.5A, 5V |
| 功率耗散（最大）: | 1.5W (Ta), 28.5W (Tj) |
| 封装: | Tube |
| 封裝/箱體: | TO-251-3 Short Leads, IPak, TO-251AA |
| 其他名稱: | NTD3055L170-001OS |
| 工作溫度: | -55°C ~ 175°C (TJ) |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | NTD3055L170-001 |
| 輸入電容（Ciss）（Max）@ Vds: | 275pF @ 25V |
| 柵極電荷（Qg）（Max）@ Vgs: | 10nC @ 5V |
| FET型: | N-Channel |
| FET特點: | - |
| 展開說明: | N-Channel 60V 9A (Ta) 1.5W (Ta), 28.5W (Tj) Through Hole I-Pak |
| 漏極至源極電壓（Vdss）: | 60V |
| 描述: | MOSFET N-CH 60V 9A IPAK |
| 電流 - 25°C連續排水（Id）: | 9A (Ta) |
| Email: | [email protected] |
NTD3055L170-001的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
NTD3055L104G | ON Semiconductor | MOSFET N-CH 60V 12A DPAK | 在線詢價 |
|
NTD3055L170T4G | ON Semiconductor | MOSFET N-CH 60V 9A DPAK | 在線詢價 |
|
NTD3055L170 | ON Semiconductor | MOSFET N-CH 60V 9A DPAK | 在線詢價 |
 |
NTD3055-150-1G | ON Semiconductor | MOSFET N-CH 60V 9A IPAK | 在線詢價 |
|
NTD3055L170G | ON Semiconductor | MOSFET N-CH 60V 9A DPAK | 在線詢價 |
|
NTD3055L170-1G | ON Semiconductor | MOSFET N-CH 60V 9A IPAK | 在線詢價 |
|
NTD3055-094-1G | ON Semiconductor | MOSFET N-CH 60V 12A IPAK | 在線詢價 |
|
NTD3055L104T4G | ON Semiconductor | MOSFET N-CH 60V 12A DPAK | 在線詢價 |
|
NTD3055L104 | ON Semiconductor | MOSFET N-CH 60V 12A DPAK | 在線詢價 |
|
NTD3055L104-1G | ON Semiconductor | MOSFET N-CH 60V 12A IPAK | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers