購買 NC7WV17L6X與BYCHPS
購買即有保證
NC7WV17L6X
- 型號:
- NC7WV17L6X
- 描述:
- IC BUFF DL SCHMT TRIG 6MICROPAK
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18447 Pieces
- 數據表:
- NC7WV17L6X.pdf
簡單介紹
BYCHIPS是 NC7WV17L6X的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的NC7WV17L6X購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 0.9 V ~ 3.6 V |
|---|---|
| 供應商設備封裝: | 6-MicroPak |
| 系列: | 7WV |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 6-UFDFN |
| 輸出類型: | Push-Pull |
| 其他名稱: | NC7WV17L6X-ND NC7WV17L6XTR |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 元素的數量: | 2 |
| 每個元件的位元數: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 6 Weeks |
| 製造商零件編號: | NC7WV17L6X |
| 邏輯類型: | Buffer, Non-Inverting |
| 輸入類型: | Schmitt Trigger |
| 展開說明: | Buffer, Non-Inverting Element 1 Bit per Element Push-Pull Output 6-MicroPak |
| 描述: | IC BUFF DL SCHMT TRIG 6MICROPAK |
| 電流 - 輸出高，低: | 24mA, 24mA |
| Email: | [email protected] |
NC7WV17L6X的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
NC7WV16P6X | Fairchild/ON Semiconductor | IC BUFF DL ULP-A N-INV SC70-6 | 在線詢價 |
|
NC7WV14P6X | Fairchild/ON Semiconductor | IC INVERTER ULP-A DUAL SC70-6 | 在線詢價 |
 |
SN74AUP1G125DRLR | Texas Instruments | IC BUS BUFFER TRI-ST SOT5 | 在線詢價 |
|
NC7WV04P6X | Fairchild/ON Semiconductor | IC INVERTER ULP-A DUAL SC70-6 | 在線詢價 |
 |
NC7WV07L6X_F065 | Fairchild/ON Semiconductor | IC BUFF DL ULP-A O/DR 6MICROPAK | 在線詢價 |
 |
NC7WV125K8X | Fairchild/ON Semiconductor | IC BUFF TRI-ST ULP-A US8 | 在線詢價 |
|
NC7WV16L6X | Fairchild/ON Semiconductor | IC BUFF DL ULP-A N-INV 6MICROPAK | 在線詢價 |
|
NC7WV14L6X | Fairchild/ON Semiconductor | IC INVERTER ULP-A DUAL 6MICROPAK | 在線詢價 |
|
NC7WV04L6X | Fairchild/ON Semiconductor | IC INVERTER ULP-A DUAL 6MICROPAK | 在線詢價 |
|
NC7WV07L6X | Fairchild/ON Semiconductor | IC BUFF DL ULP-A O/DR 6MICROPAK | 在線詢價 |
|
NC7WV17P6X | Fairchild/ON Semiconductor | IC BUFF DL SCHMT TRIG SC70-6 | 在線詢價 |
 |
MC74ACT245DWR2G | ON Semiconductor | IC TRANSCVR TRI-ST 8BIT 20SOIC | 在線詢價 |
|
NC7WV07P6X | Fairchild/ON Semiconductor | IC BUFF DL ULP-A O/DRAIN SC70-6 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers