購買 MCP23S18-E/MJ與BYCHPS
購買即有保證
MCP23S18-E/MJ
- 型號:
- MCP23S18-E/MJ
- 描述:
- IC I/O EXPANDER SPI 16B 24QFN
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16161 Pieces
簡單介紹
BYCHIPS是 MCP23S18-E/MJ的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的MCP23S18-E/MJ購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 1.8 V ~ 5.5 V |
|---|---|
| 供應商設備封裝: | 24-QFN (4x4) |
| 系列: | - |
| 封装: | Tray |
| 封裝/箱體: | 24-VFQFN Exposed Pad |
| 輸出類型: | Open Drain |
| 其他名稱: | MCP23S18EMJ |
| 工作溫度: | -40°C ~ 125°C |
| I / O數量: | 16 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 3 Weeks |
| 製造商零件編號: | MCP23S18-E/MJ |
| 中斷輸出: | Yes |
| 接口: | SPI |
| 特徵: | - |
| 展開說明: | I/O Expander 16 SPI 24-QFN (4x4) |
| 描述: | IC I/O EXPANDER SPI 16B 24QFN |
| 電流 - 輸出源/匯流排: | 25mA |
| 時鐘頻率: | 10MHz |
| Email: | [email protected] |
MCP23S18-E/MJ的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog