購買 MBRD835LT4G與BYCHPS
購買即有保證
MBRD835LT4G
- 型號:
- MBRD835LT4G
- 描述:
- DIODE SCHOTTKY 35V 8A DPAK
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12446 Pieces
- 數據表:
- MBRD835LT4G.pdf
簡單介紹
BYCHIPS是 MBRD835LT4G的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的MBRD835LT4G購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 正向（Vf）（最大）: | 510mV @ 8A |
|---|---|
| 電壓 - （Vr）（最大）: | 35V |
| 供應商設備封裝: | DPAK-3 |
| 速度: | Fast Recovery = 200mA (Io) |
| 系列: | SWITCHMODE™ |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| 其他名稱: | MBRD835LT4GOSTR |
| 工作溫度 - 結: | -65°C ~ 150°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 14 Weeks |
| 製造商零件編號: | MBRD835LT4G |
| 展開說明: | Diode Schottky 35V 8A Surface Mount DPAK-3 |
| 二極管類型: | Schottky |
| 描述: | DIODE SCHOTTKY 35V 8A DPAK |
| 電流 - Vr時反向漏電: | 1.4mA @ 35V |
| 電流 - 平均整流（Io）: | 8A |
| 電容@ Vr，F時: | - |
| Email: | [email protected] |
MBRD835LT4G的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
MBRD835LT4 | ON Semiconductor | DIODE SCHOTTKY 35V 8A DPAK | 在線詢價 |
|
MBRD835LG | ON Semiconductor | DIODE SCHOTTKY 35V 8A DPAK | 在線詢價 |
 |
SET061211 | Semtech Corporation | DIODE GEN PURP 150V 30A MODULE | 在線詢價 |
 |
MBR3545 | GeneSiC Semiconductor | DIODE SCHOTTKY 45V 35A DO4 | 在線詢價 |
|
MBRD835L | ON Semiconductor | DIODE SCHOTTKY 35V 8A DPAK | 在線詢價 |
 |
DPG10I300PA | IXYS | DIODE GEN PURP 300V 10A TO220AC | 在線詢價 |
 |
SB320E-G | Comchip Technology | DIODE SCHOTTKY 20V 3A DO201AD | 在線詢價 |
 |
MEO450-12DA | IXYS | DIODE MODULE 1.2KV 453A Y4-M6 | 在線詢價 |
 |
RBR3MM60ATR | Rohm Semiconductor | DIODE SCHOTTKY 60V 3A PMDU | 在線詢價 |
 |
RF051VA2STR | Rohm Semiconductor | DIODE GEN PURP 200V 500MA TUMD2 | 在線詢價 |
 |
NSB8BT-E3/45 | Vishay Semiconductor Diodes Division | DIODE GEN PURP 100V 8A TO263AB | 在線詢價 |
 |
CD214B-B260LF | Bourns Inc. | DIODE SCHOTTKY 60V 2A DO214AA | 在線詢價 |
 |
A330D | Powerex Inc. | DIODE STD 1200A 400V DO-200AA | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers