購買 MAX31855EASA+T與BYCHPS
購買即有保證
MAX31855EASA+T
- 型號:
- MAX31855EASA+T
- 製造商:
- Maxim Integrated
- 描述:
- IC CONV THERMOCOUPLE-DGTL 8SOIC
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15924 Pieces
簡單介紹
BYCHIPS是 MAX31855EASA+T的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的MAX31855EASA+T購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Thermocouple to Digital Converter |
|---|---|
| 供應商設備封裝: | 8-SOIC |
| 系列: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 8-SOIC (0.154", 3.90mm Width) |
| 輸出類型: | Digital |
| 其他名稱: | MAX31855EASA+T-ND MAX31855EASA+TTR |
| 工作溫度: | -40°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | MAX31855EASA+T |
| 接口: | SPI |
| 輸入類型: | Thermocouple (Multiple) |
| 描述: | IC CONV THERMOCOUPLE-DGTL 8SOIC |
| 供電: | 900µA |
| Email: | [email protected] |
MAX31855EASA+T的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
MAX31855KASA+ | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL SOIC | 在線詢價 |
|
MAX31855RASA+T | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL 8SOIC | 在線詢價 |
|
MAX31850TATB+T | Maxim Integrated | IC CONV THRMCPLE-DIG T TYPE TDFN | 在線詢價 |
|
MAX31855RASA+ | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL 8SOIC | 在線詢價 |
|
MAX31855JASA+T | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL 8SOIC | 在線詢價 |
|
MAX31855EASA+ | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL 8SOIC | 在線詢價 |
|
MAX31850JATB+T | Maxim Integrated | IC CONV THRMCPLE-DIG J TYPE TDFN | 在線詢價 |
|
MAX31855TASA+ | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL 8SOIC | 在線詢價 |
|
MAX31855SASA+ | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL 8SOIC | 在線詢價 |
|
MAX31855KASA+T | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL SOIC | 在線詢價 |
|
MAX31855SASA+T | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL 8SOIC | 在線詢價 |
|
MAX31855JASA+ | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL 8SOIC | 在線詢價 |
|
MAX31855TASA+T | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL 8SOIC | 在線詢價 |
|
MAX31855NASA+T | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL SOIC | 在線詢價 |
|
MAX31855NASA+ | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL SOIC | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers