購買 LFE5UM5G-85F-8BG756I與BYCHPS
購買即有保證
LFE5UM5G-85F-8BG756I
- 型號:
- LFE5UM5G-85F-8BG756I
- 描述:
- 83.6K LUTS, 365 /O, 1.1V, -8 SPE
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14965 Pieces
簡單介紹
BYCHIPS是 LFE5UM5G-85F-8BG756I的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的LFE5UM5G-85F-8BG756I購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 1.045 V ~ 1.155 V |
|---|---|
| 總RAM位數: | 3833856 |
| 供應商設備封裝: | 756-CABGA (27x27) |
| 系列: | ECP5-5G |
| 封裝/箱體: | 756-FBGA |
| 其他名稱: | 220-2116 |
| 工作溫度: | -40°C ~ 100°C (TJ) |
| 邏輯元件數/細胞: | 84000 |
| 的LAB數/個CLB: | 21000 |
| I / O數量: | 365 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商零件編號: | LFE5UM5G-85F-8BG756I |
| 描述: | 83.6K LUTS, 365 /O, 1.1V, -8 SPE |
| Email: | [email protected] |
LFE5UM5G-85F-8BG756I的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers