購買 JMK021BJ472KK5W與BYCHPS
購買即有保證
JMK021BJ472KK5W
- 型號:
- JMK021BJ472KK5W
- 製造商:
- Taiyo Yuden
- 描述:
- CAP CER 4700PF 6.3V X5R 008004
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18512 Pieces
簡單介紹
BYCHIPS是 JMK021BJ472KK5W的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的JMK021BJ472KK5W購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 6.3V |
|---|---|
| 公差: | ±10% |
| 厚度（最大）: | 0.006" (0.14mm) |
| 溫度係數: | X5R |
| 尺寸/尺寸: | 0.010" L x 0.005" W (0.25mm x 0.13mm) |
| 系列: | M |
| 評級: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 008004 (0201 Metric) |
| 其他名稱: | 587-4849-2 RM JMK021 BJ472KK5W |
| 工作溫度: | -55°C ~ 85°C |
| 安裝類型: | Surface Mount, MLCC |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 12 Weeks |
| 製造商零件編號: | JMK021BJ472KK5W |
| 引線型: | - |
| 引線間距: | - |
| 高度 - 座高（最大）: | - |
| 特徵: | - |
| 展開說明: | 4700pF ±10% 6.3V Ceramic Capacitor X5R 008004 (0201 Metric) |
| 描述: | CAP CER 4700PF 6.3V X5R 008004 |
| 電容: | 4700pF |
| 應用: | General Purpose |
| Email: | [email protected] |
JMK021BJ472KK5W的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
JMK021BJ103KK5W | Taiyo Yuden | CAP CER 10000PF 6.3V X5R 008004 | 在線詢價 |
|
JMK021BJ472KK-W | Taiyo Yuden | CAP CER 4700PF 6.3V X5R 008004 | 在線詢價 |
|
JMK021BJ222KK5W | Taiyo Yuden | CAP CER 2200PF 6.3V X5R 008004 | 在線詢價 |
 |
GRM0335C1H3R5CA01D | Murata Electronics North America | CAP CER 3.5PF 50V NP0 0201 | 在線詢價 |
|
JMK021BJ103KK-W | Taiyo Yuden | CAP CER 10000PF 6.3V X5R 008004 | 在線詢價 |
 |
2225Y0100105MXR | Knowles Syfer | CAP CER 2225 | 在線詢價 |
|
GQM1555C2DR10WB01D | Murata Electronics North America | CAP CER 0.1PF 200V NP0 0402 | 在線詢價 |
|
GJM0335C1E8R4CB01D | Murata Electronics North America | CAP CER 8.4PF 25V C0G/NP0 0201 | 在線詢價 |
 |
K821J15C0GK53H5 | Vishay BC Components | CAP CER 820PF 200V C0G/NP0 RAD | 在線詢價 |
|
JMK021BJ222KK-W | Taiyo Yuden | CAP CER 2200PF 6.3V X5R 008004 | 在線詢價 |
|
1206Y1K20270FCR | Knowles Syfer | CAP CER 1206 | 在線詢價 |
|
1825J1K20152FCT | Knowles Syfer | CAP CER 1825 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers