購買 IXGR24N60CD1與BYCHPS
購買即有保證
IXGR24N60CD1
- 型號:
- IXGR24N60CD1
- 製造商:
- IXYS Corporation
- 描述:
- IGBT 600V 42A 80W ISOPLUS247
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18807 Pieces
- 數據表:
- IXGR24N60CD1.pdf
簡單介紹
BYCHIPS是 IXGR24N60CD1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IXGR24N60CD1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 600V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | 2.5V @ 15V, 24A |
| 測試條件: | 480V, 24A, 18 Ohm, 15V |
| Td（開/關）@ 25°C: | 15ns/75ns |
| 開關能量: | 240µJ (off) |
| 供應商設備封裝: | ISOPLUS247™ |
| 系列: | HiPerFAST™ |
| 反向恢復時間（trr）: | 25ns |
| 功率 - 最大: | 80W |
| 封装: | Tube |
| 封裝/箱體: | ISOPLUS247™ |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | IXGR24N60CD1 |
| 輸入類型: | Standard |
| IGBT類型: | - |
| 柵極電荷: | 55nC |
| 展開說明: | IGBT 600V 42A 80W Through Hole ISOPLUS247™ |
| 描述: | IGBT 600V 42A 80W ISOPLUS247 |
| 電流 - 集電極脈衝（ICM）: | 80A |
| 電流 - 集電極（Ic）（最大）: | 42A |
| Email: | [email protected] |
IXGR24N60CD1的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
IXGR24N120C3D1 | IXYS | IGBT 1200V 48A 200W ISOPLUS247 | 在線詢價 |
 |
IRG8P25N120KD-EPBF | Infineon Technologies | IGBT 1200V 40A 180W TO-247AD | 在線詢價 |
|
IXGR24N60C | IXYS | IGBT 600V 42A 80W ISOPLUS247 | 在線詢價 |
|
IXGR24N120C3H1 | IXYS | IGBT 1200V 48A ISOPLUS247 | 在線詢價 |
|
IXGR24N60B | IXYS | IGBT 600V 42A 80W ISOPLUS247 | 在線詢價 |
 |
IXYF30N450 | IXYS | IGBT 450V | 在線詢價 |
 |
IRG4BC30W | Infineon Technologies | IGBT 600V 23A 100W TO220AB | 在線詢價 |
 |
STGW60V60F | STMicroelectronics | IGBT 600V 80A 375W TO247 | 在線詢價 |
 |
APT15GP60BG | Microsemi Corporation | IGBT 600V 56A 250W TO247 | 在線詢價 |
 |
RJH65D27BDPQ-A0#T0 | Renesas Electronics America | IGBT 650V | 在線詢價 |
|
STGWT20V60F | STMicroelectronics | IGBT 600V 40A 167W TO3PF | 在線詢價 |
 |
STGFW40H65FB | STMicroelectronics | IGBT HB 650V 40A ISOWATT218 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers