購買 IXGN50N120C3H1與BYCHPS
購買即有保證
IXGN50N120C3H1
- 型號:
- IXGN50N120C3H1
- 製造商:
- IXYS Corporation
- 描述:
- IGBT 1200V 95A SOT-227
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15530 Pieces
簡單介紹
BYCHIPS是 IXGN50N120C3H1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IXGN50N120C3H1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 1200V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | 4.2V @ 15V, 40A |
| 供應商設備封裝: | SOT-227B |
| 系列: | GenX3™ |
| 功率 - 最大: | 460W |
| 封裝/箱體: | SOT-227-4, miniBLOC |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| NTC熱敏電阻: | No |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | IXGN50N120C3H1 |
| 輸入電容（連鎖商店）@的Vce: | 4.3nF @ 25V |
| 輸入: | Standard |
| IGBT類型: | PT |
| 展開說明: | IGBT Module PT Single 1200V 95A 460W Chassis Mount SOT-227B |
| 描述: | IGBT 1200V 95A SOT-227 |
| 電流 - 集電極截止（最大）: | 250µA |
| 電流 - 集電極（Ic）（最大）: | 95A |
| 組態: | Single |
| Email: | [email protected] |
IXGN50N120C3H1的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
VS-GB90SA120U | Vishay Semiconductor Diodes Division | TRANSISTOR INSLTED GATE BIPOLAR | 在線詢價 |
 |
VDI130-06P1 | IXYS | MOD IGBT BUCK 600V ECO-PAC2 | 在線詢價 |
|
IXGN50N60BD3 | IXYS | IGBT 600V FRD SOT-227B | 在線詢價 |
 |
VS-GB400AH120N | Vishay Semiconductor Diodes Division | IGBT 1200V 650A 2500W INT-A-PAK | 在線詢價 |
|
IXGN50N60BD2 | IXYS | IGBT 600V FRD SOT-227B | 在線詢價 |
 |
APTGT75DA170T1G | Microsemi Corporation | IGBT 1700V 130A 465W SP1 | 在線詢價 |
|
IXGN50N60B | IXYS | IGBT 75A 600V SOT-227B | 在線詢價 |
 |
IRG7T200CL12B | Infineon Technologies | MOD IGBT 1200V 200A POWIR 62 | 在線詢價 |
|
MIAA10WF600TMH | IXYS | MODULE IGBT CBI | 在線詢價 |
 |
CM300DU-24F | Powerex Inc. | IGBT MOD DUAL 1200V 300A F SER | 在線詢價 |
|
APTGT35DA120D1G | Microsemi Corporation | IGBT 1200V 55A 205W D1 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers