購買 ISL33002IRTZ-T與BYCHPS
購買即有保證
ISL33002IRTZ-T
- 型號:
- ISL33002IRTZ-T
- 製造商:
- Intersil
- 描述:
- IC ACCELERATOR I2C HOTSWAP 8TDFN
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18336 Pieces
簡單介紹
BYCHIPS是 ISL33002IRTZ-T的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的ISL33002IRTZ-T購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 2.3 V ~ 5.5 V |
|---|---|
| 類型: | Buffer, Accelerator |
| 供應商設備封裝: | 8-TDFN (3x3) |
| 信號調理: | - |
| 系列: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 8-WDFN Exposed Pad |
| 產量: | 2-Wire Bus |
| 工作溫度: | -40°C ~ 85°C |
| 通道數: | 2 |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 6 Weeks |
| 製造商零件編號: | ISL33002IRTZ-T |
| 輸入: | 2-Wire Bus |
| 展開說明: | Buffer, Accelerator 2 Channel 8-TDFN (3x3) |
| 描述: | IC ACCELERATOR I2C HOTSWAP 8TDFN |
| 延遲時間: | - |
| 數據速率（最大）: | - |
| 供電: | 3mA |
| 電容 - 輸入: | 10pF |
| 應用: | I²C - Hotswap |
| Email: | [email protected] |
ISL33002IRTZ-T的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
ISL33001IRT2Z-T | Intersil | IC ACCELERATOR I2C HOTSWAP 8TDFN | 在線詢價 |
|
ISL33002IRT2Z | Intersil | IC ACCELERATOR I2C HOTSWAP 8TDFN | 在線詢價 |
|
ISL33003IRT2Z | Intersil | IC ACCELERATOR I2C HOTSWAP 8TDFN | 在線詢價 |
|
ISL33002IRTZ | Intersil | IC ACCELERATOR I2C HOTSWAP 8TDFN | 在線詢價 |
 |
ISL33001IBZ | Intersil | IC ACCELERATOR I2C HOTSWAP 8SOIC | 在線詢價 |
|
ISL33002IRT2Z-T | Intersil | IC ACCELERATOR I2C HOTSWAP 8TDFN | 在線詢價 |
 |
ISL33003IUZ | Intersil | IC ACCELERATOR I2C HOTSWAP 8MSOP | 在線詢價 |
|
ISL33002IUZ | Intersil | IC ACCELERATOR I2C HOTSWAP 8MSOP | 在線詢價 |
|
ISL33002IUZ-T | Intersil | IC ACCELERATOR I2C HOTSWAP 8MSOP | 在線詢價 |
|
ISL33003IRTZ-T | Intersil | IC ACCELERATOR I2C HOTSWAP 8TDFN | 在線詢價 |
|
ISL33001IUZ | Intersil | IC ACCELERATOR I2C HOTSWAP 8MSOP | 在線詢價 |
|
ISL33003IUZ-T | Intersil | IC ACCELERATOR I2C HOTSWAP 8MSOP | 在線詢價 |
|
ISL33001IRTZ-T | Intersil | IC ACCELERATOR I2C HOTSWAP 8TDFN | 在線詢價 |
|
ISL33001IBZ-T | Intersil | IC ACCELERATOR I2C HOTSWAP 8SOIC | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers