購買 ISL21010CFH333Z-T7A與BYCHPS
購買即有保證
ISL21010CFH333Z-T7A
- 型號:
- ISL21010CFH333Z-T7A
- 製造商:
- Intersil
- 描述:
- IC VREF SERIES 3.3V SOT23-3
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 20231 Pieces
簡單介紹
BYCHIPS是 ISL21010CFH333Z-T7A的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的ISL21010CFH333Z-T7A購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 輸出（最小/固定）: | 3.3V |
|---|---|
| 電壓 - 輸出（最大）: | - |
| 電壓 - 輸入: | 3.4 V ~ 5.5 V |
| 公差: | ±0.2% |
| 溫度係數: | 50ppm/°C |
| 供應商設備封裝: | SOT-23-3 |
| 系列: | - |
| 參考類型: | Series |
| 封装: | Original-Reel® |
| 封裝/箱體: | TO-236-3, SC-59, SOT-23-3 |
| 輸出類型: | Fixed |
| 工作溫度: | -40°C ~ 125°C (TA) |
| 噪音 - 10Hz至10kHz: | 40µVrms |
| 噪聲 - 0.1Hz至10Hz: | 95µVp-p |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 5 Weeks |
| 製造商零件編號: | ISL21010CFH333Z-T7A |
| 展開說明: | Series Voltage Reference IC ±0.2% 25mA SOT-23-3 |
| 描述: | IC VREF SERIES 3.3V SOT23-3 |
| 供電: | 100µA |
| 電流 - 輸出: | 25mA |
| 電流 - 陰極: | - |
| Email: | [email protected] |
ISL21010CFH333Z-T7A的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
ISL21010CFH333Z-TK | Intersil | IC VREF SERIES 3.3V SOT23-3 | 在線詢價 |
|
ISL21010CFH330Z-T7A | Intersil | IC VREF SERIES 3V SOT23-3 | 在線詢價 |
|
ISL21010CFH320Z-TK | Intersil | IC VREF SERIES 2.048V SOT23-3 | 在線詢價 |
|
ISL21010CFH320Z-T7A | Intersil | IC VREF SERIES 2.048V SOT23-3 | 在線詢價 |
|
ISL21010CFH330Z-TK | Intersil | IC VREF SERIES 3V SOT23-3 | 在線詢價 |
|
ISL21010CFH325Z-T7A | Intersil | IC VREF SERIES 2.5V SOT23-3 | 在線詢價 |
|
ISL21010DFH312Z-T7A | Intersil | IC VREF SERIES 1.25V SOT23-3 | 在線詢價 |
|
ISL21010CFH315Z-T7A | Intersil | IC VREF SERIES 1.5V SOT23-3 | 在線詢價 |
|
ISL21010CFH341Z-TK | Intersil | IC VREF SERIES 4.096V SOT23-3 | 在線詢價 |
|
ISL21010CFH341Z-T7A | Intersil | IC VREF SERIES 4.096V SOT23-3 | 在線詢價 |
|
ISL21010CFH325Z-TK | Intersil | IC VREF SERIES 2.5V SOT23-3 | 在線詢價 |
|
ISL21010DFH312Z-TK | Intersil | IC VREF SERIES 1.25V SOT23-3 | 在線詢價 |
|
ISL21010CFH315Z-TK | Intersil | IC VREF SERIES 1.5V SOT23-3 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers