購買 IRG4BC30WSTRR與BYCHPS
購買即有保證
IRG4BC30WSTRR
- 型號:
- IRG4BC30WSTRR
- 描述:
- IGBT D2PAK
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 15510 Pieces
簡單介紹
BYCHIPS是 IRG4BC30WSTRR的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IRG4BC30WSTRR購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 600V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | 2.7V @ 15V, 12A |
| 供應商設備封裝: | D2PAK |
| 系列: | - |
| 功率 - 最大: | 100W |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| 工作溫度: | - |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | IRG4BC30WSTRR |
| 輸入類型: | Standard |
| IGBT類型: | - |
| 展開說明: | IGBT 600V 23A 100W Surface Mount D2PAK |
| 描述: | IGBT D2PAK |
| 電流 - 集電極（Ic）（最大）: | 23A |
| Email: | [email protected] |
IRG4BC30WSTRR的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers