購買 ICS557GI-06與BYCHPS
購買即有保證
ICS557GI-06
- 型號:
- ICS557GI-06
- 描述:
- IC CLK BUFFER 1:4 HCSL 20-TSSOP
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 16479 Pieces
- 數據表:
- ICS557GI-06.pdf
簡單介紹
BYCHIPS是 ICS557GI-06的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的ICS557GI-06購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 3.135 V ~ 3.465 V |
|---|---|
| 供應商設備封裝: | 20-TSSOP |
| 系列: | - |
| 比率 - 輸入：輸出: | 2:4 |
| 封装: | Tube |
| 封裝/箱體: | 20-TSSOP (0.173", 4.40mm Width) |
| PLL: | No |
| 產量: | HCSL, LVDS |
| 其他名稱: | 557GI-06 |
| 工作溫度: | -40°C ~ 85°C |
| 電路數: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | ICS557GI-06 |
| 主要目的: | PCI Express (PCIe) |
| 輸入: | HCSL, LVDS |
| 頻率 - 最大: | 200MHz |
| 差分 - 輸入：輸出: | Yes/Yes |
| 描述: | IC CLK BUFFER 1:4 HCSL 20-TSSOP |
| Email: | [email protected] |
ICS557GI-06的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers