購買 HP09DW105KN與BYCHPS
購買即有保證
HP09DW105KN
- 型號:
- HP09DW105KN
- 製造商:
- KEMET
- 描述:
- CAP CER 1UF 200V X7R RADIAL
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 17575 Pieces
- 數據表:
- HP09DW105KN.pdf
簡單介紹
BYCHIPS是 HP09DW105KN的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的HP09DW105KN購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 200V |
|---|---|
| 公差: | ±10% |
| 厚度（最大）: | - |
| 溫度係數: | X7R |
| 尺寸/尺寸: | 0.700" L x 0.200" W (17.78mm x 5.08mm) |
| 系列: | HP |
| 評級: | - |
| 封装: | Bulk |
| 封裝/箱體: | Radial |
| 工作溫度: | -55°C ~ 200°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 26 Weeks |
| 製造商零件編號: | HP09DW105KN |
| 引線型: | - |
| 引線間距: | 0.500" (12.70mm) |
| 高度 - 座高（最大）: | 0.400" (10.16mm) |
| 特徵: | High Temperature |
| 失敗率: | - |
| 展開說明: | 1µF ±10% 200V Ceramic Capacitor X7R Radial |
| 描述: | CAP CER 1UF 200V X7R RADIAL |
| 電容: | 1µF |
| 應用: | General Purpose |
| Email: | [email protected] |
HP09DW105KN的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers