購買 HEF4007UBT,653與BYCHPS
購買即有保證
HEF4007UBT,653
- 型號:
- HEF4007UBT,653
- 製造商:
- Nexperia
- 描述:
- IC DUAL PAIR/INVERTER 14SOIC
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16949 Pieces
簡單介紹
BYCHIPS是 HEF4007UBT,653的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的HEF4007UBT,653購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電源電壓: | 3 V ~ 18 V |
|---|---|
| 供應商設備封裝: | 14-SO |
| 系列: | 4000B |
| 封装: | Original-Reel® |
| 封裝/箱體: | 14-SOIC (0.154", 3.90mm Width) |
| 其他名稱: | 1727-2144-6 568-11865-6 568-11865-6-ND 568-12298-6-ND |
| 工作溫度: | -40°C ~ 85°C |
| 比特數: | 3 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | HEF4007UBT,653 |
| 邏輯類型: | Complementary Pair Plus Inverter |
| 展開說明: | Complementary Pair Plus Inverter IC 14-SO |
| 描述: | IC DUAL PAIR/INVERTER 14SOIC |
| Email: | [email protected] |
HEF4007UBT,653的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers