購買 GNM212R61A225ME16D與BYCHPS
購買即有保證
GNM212R61A225ME16D
- 型號:
- GNM212R61A225ME16D
- 描述:
- CAP ARRAY 2.2UF 10V X5R 0805
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12559 Pieces
簡單介紹
BYCHIPS是 GNM212R61A225ME16D的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的GNM212R61A225ME16D購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 10V |
|---|---|
| 公差: | ±20% |
| 溫度係數: | X5R |
| 尺寸/尺寸: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| 系列: | GNM |
| 評級: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 0805 (2012 Metric) |
| 電容器數: | 2 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | GNM212R61A225ME16D |
| 高度 - 座高（最大）: | 0.037" (0.94mm) |
| 展開說明: | 2.2µF ±20% Isolated Capacitor Array 10V X5R 0805 (2012 Metric) |
| 絕緣材料: | Ceramic |
| 描述: | CAP ARRAY 2.2UF 10V X5R 0805 |
| 電路類型: | Isolated |
| 電容: | 2.2µF |
| Email: | [email protected] |
GNM212R61A225ME16D的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog