購買 FGH0V474ZF與BYCHPS
購買即有保證
FGH0V474ZF
- 型號:
- FGH0V474ZF
- 製造商:
- KEMET
- 描述:
- CAP 470MF -20% +80% 3.5V T/H
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19913 Pieces
- 數據表:
- FGH0V474ZF.pdf
簡單介紹
BYCHIPS是 FGH0V474ZF的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的FGH0V474ZF購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 3.5V |
|---|---|
| 公差: | -20%, +80% |
| 終止: | Through Hole |
| 尺寸/尺寸: | 0.512" Dia (13.00mm) |
| 系列: | FGH |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Can |
| 其他名稱: | 399-10800 |
| 工作溫度: | -25°C ~ 70°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | FGH0V474ZF |
| 壽命@溫度。: | - |
| 引線間距: | 0.200" (5.08mm) |
| 高度 - 座高（最大）: | 0.295" (7.50mm) |
| 展開說明: | 470mF -20%, +80%(EDLC) Supercapacitor 3.5V Radial, Can 25 Ohm @ 1kHz |
| ESR（等效串聯電阻）: | 25 Ohm @ 1kHz |
| 描述: | CAP 470MF -20% +80% 3.5V T/H |
| 電容: | 470mF |
| Email: | [email protected] |
FGH0V474ZF的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
MAL219622684E3 | Vishay BC Components | CAP 680MF -20%, +80% 5.5V T/H | 在線詢價 |
 |
EEC-S0HD334H | Panasonic Electronic Components | CAP 330MF -20% +80% 5.5V T/H | 在線詢價 |
 |
PHV-5R4V474-R | Eaton | CAP 470MF -10% +30% 5.4V T/H | 在線詢價 |
 |
ESHSR-0650C0-002R7A5 | NessCap Co Ltd | CAP 650F 0% +20% 2.7V AXIAL CAN | 在線詢價 |
 |
EDLEN204A3R3S | Cornell Dubilier Electronics (CDE) | CAP 200MF 3.3V SURFACE MOUNT | 在線詢價 |
|
MAL219690111E3 | Vishay BC Components | CAP 90F -20%, +80% 4.2V T/H | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers