購買 FERD40H100STS與BYCHPS
購買即有保證
FERD40H100STS
- 型號:
- FERD40H100STS
- 製造商:
- ST
- 描述:
- DIODE GEN PURP 100V 40A TO220AB
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18608 Pieces
簡單介紹
BYCHIPS是 FERD40H100STS的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的FERD40H100STS購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 正向（Vf）（最大）: | 705mV @ 40A |
|---|---|
| 電壓 - （Vr）（最大）: | 100V |
| 供應商設備封裝: | TO-220AB |
| 速度: | Standard Recovery >500ns, > 200mA (Io) |
| 系列: | - |
| 封装: | Tube |
| 封裝/箱體: | TO-220-3 |
| 其他名稱: | FERD40H100STS-ND |
| 工作溫度 - 結: | 175°C (Max) |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 13 Weeks |
| 製造商零件編號: | FERD40H100STS |
| 展開說明: | Diode Standard 100V 40A Through Hole TO-220AB |
| 二極管類型: | Standard |
| 描述: | DIODE GEN PURP 100V 40A TO220AB |
| 電流 - Vr時反向漏電: | 190µA @ 100V |
| 電流 - 平均整流（Io）: | 40A |
| 電容@ Vr，F時: | - |
| Email: | [email protected] |
FERD40H100STS的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
SMD13HE-TP | Micro Commercial Co | DIODE SCHOTTKY 30V 1A SOD123HE | 在線詢價 |
 |
FERD40U45CT | STMicroelectronics | DIODE ARRAY GP 45V 20A TO220AB | 在線詢價 |
 |
FERD40U50CFP | STMicroelectronics | DIODE FET 20A 50V TO-220FP | 在線詢價 |
 |
FERD40H100SG-TR | STMicroelectronics | DIODE GEN PURP 100V 40A D2PAK | 在線詢價 |
 |
R6200450XXOO | Powerex Inc. | DIODE MODULE 400V 500A DO200AA | 在線詢價 |
|
FERD40U45CG-TR | STMicroelectronics | DIODE ARRAY GP 45V 20A D2PAK | 在線詢價 |
|
FERD40M45CT | STMicroelectronics | DIODE ARRAY GP 45V 20A TO220AB | 在線詢價 |
|
FERD40M45CG-TR | STMicroelectronics | DIODE ARRAY GP 45V 20A D2PAK | 在線詢價 |
 |
S3M-M3/57T | Vishay Semiconductor Diodes Division | DIODE GPP 3A 1000V DO-214AB | 在線詢價 |
 |
U1D-M3/5AT | Vishay Semiconductor Diodes Division | DIODE RECT 1A 200V DO-214AC | 在線詢價 |
 |
UPR20E3/TR13 | Microsemi Corporation | DIODE GEN PURP 200V 2A POWERMITE | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers