購買 F17733682951與BYCHPS
購買即有保證
F17733682951
- 型號:
- F17733682951
- 描述:
- CAP FILM 0.068UF 630VDC AXIAL
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17100 Pieces
- 數據表:
- F17733682951.pdf
簡單介紹
BYCHIPS是 F17733682951的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的F17733682951購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓 - 直流: | 630V |
|---|---|
| 額定電壓 - AC: | 253V |
| 公差: | ±20% |
| 終止: | PC Pins |
| 尺寸/尺寸: | 0.315" Dia x 0.748" L (8.00mm x 19.00mm) |
| 系列: | F1773 |
| 封装: | Bulk |
| 封裝/箱體: | Axial |
| 其他名稱: | 17733682951 |
| 工作溫度: | -40°C ~ 100°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 17 Weeks |
| 製造商零件編號: | F17733682951 |
| 引線間距: | - |
| 高度 - 座高（最大）: | - |
| 特徵: | X2 Safety Rated |
| 展開說明: | 0.068µF ±20% Film Capacitor 253V 630V Polyester, Metallized Axial |
| ESR（等效串聯電阻）: | - |
| 絕緣材料: | Polyester, Metallized |
| 描述: | CAP FILM 0.068UF 630VDC AXIAL |
| 電容: | 0.068µF |
| 應用: | EMI, RFI Suppression |
| Email: | [email protected] |
F17733682951的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
F17733682000 | Vishay BC Components | CAP FILM 0.068UF 630VDC AXIAL | 在線詢價 |
|
F17733682900 | Vishay BC Components | CAP FILM 0.068UF 630VDC AXIAL | 在線詢價 |
|
F17733472000 | Vishay BC Components | CAP FILM 0.047UF 630VDC AXIAL | 在線詢價 |
|
F17733102000 | Vishay BC Components | CAP FILM 10000PF 630VDC AXIAL | 在線詢價 |
|
F17733472904 | Vishay BC Components | CAP FILM 0.047UF 630VDC AXIAL | 在線詢價 |
|
F17733332953 | Vishay BC Components | CAP FILM 0.033UF 630VDC AXIAL | 在線詢價 |
|
F17733682001 | Vishay BC Components | CAP FILM 0.068UF 630VDC AXIAL | 在線詢價 |
|
F17733682902 | Vishay BC Components | CAP FILM 0.068UF 630VDC AXIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers