購買 F17723102230與BYCHPS
購買即有保證
F17723102230
- 型號:
- F17723102230
- 描述:
- CAP FILM 10000PF 20% 630VDC RAD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16341 Pieces
- 數據表:
- F17723102230.pdf
簡單介紹
BYCHIPS是 F17723102230的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的F17723102230購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓 - 直流: | 630V |
|---|---|
| 額定電壓 - AC: | 310V |
| 公差: | ±20% |
| 終止: | PC Pins |
| 尺寸/尺寸: | 0.689" L x 0.197" W (17.50mm x 5.00mm) |
| 系列: | F1772 |
| 封装: | Bulk |
| 封裝/箱體: | Radial |
| 其他名稱: | 17723102230 |
| 工作溫度: | -40°C ~ 110°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | F17723102230 |
| 引線間距: | 0.591" (15.00mm) |
| 高度 - 座高（最大）: | 0.433" (11.00mm) |
| 特徵: | X2 Safety Rated |
| 展開說明: | 10000pF ±20% Film Capacitor 310V 630V Polyester, Metallized Radial |
| ESR（等效串聯電阻）: | - |
| 絕緣材料: | Polyester, Metallized |
| 描述: | CAP FILM 10000PF 20% 630VDC RAD |
| 電容: | 10000pF |
| 應用: | EMI, RFI Suppression |
| Email: | [email protected] |
F17723102230的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
F17723102000 | Vishay BC Components | CAP FILM 10000PF 10% 630VDC RAD | 在線詢價 |
|
F17723102291 | Vishay BC Components | CAP FILM 10000PF 20% 630VDC RAD | 在線詢價 |
|
F17723102004 | Vishay BC Components | CAP FILM 10000PF 10% 630VDC RAD | 在線詢價 |
 |
F17723102203 | Vishay BC Components | CAP FILM 10000PF 20% 630VDC RAD | 在線詢價 |
|
F17723102290 | Vishay BC Components | CAP FILM 10000PF 20% 630VDC RAD | 在線詢價 |
|
F17723102200 | Vishay BC Components | CAP FILM 10000PF 20% 630VDC RAD | 在線詢價 |
|
F17723102030 | Vishay BC Components | CAP FILM 10000PF 10% 630VDC RAD | 在線詢價 |
|
F17723102901 | Vishay BC Components | CAP FILM 10000PF 10% 630VDC RAD | 在線詢價 |
|
F17723102900 | Vishay BC Components | CAP FILM 10000PF 10% 630VDC RAD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers