購買 EXV477M025S9PAA與BYCHPS
購買即有保證
EXV477M025S9PAA
- 型號:
- EXV477M025S9PAA
- 製造商:
- KEMET
- 描述:
- ALU ELECTROLYTIC SMD EXV 25VDC 1
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15319 Pieces
簡單介紹
BYCHIPS是 EXV477M025S9PAA的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的EXV477M025S9PAA購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 25V |
|---|---|
| 公差: | ±20% |
| 表面貼裝佔地面積: | 0.406" L x 0.406" W (10.30mm x 10.30mm) |
| 尺寸/尺寸: | 0.394" Dia (10.00mm) |
| 系列: | Automotive, AEC-Q200, EXV |
| 紋波電流: | 595mA @ 120Hz |
| 極化: | Polar |
| 封装: | - |
| 封裝/箱體: | Radial, Can - SMD |
| 工作溫度: | -55°C ~ 105°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 20 Weeks |
| 製造商零件編號: | EXV477M025S9PAA |
| 壽命@溫度。: | 5000 Hrs @ 105°C |
| 引線間距: | - |
| 阻抗: | 120 mOhm @ 100kHz |
| 高度 - 座高（最大）: | 0.413" (10.50mm) |
| 展開說明: | 470µF 25V Aluminum Capacitors Radial, Can - SMD 5000 Hrs @ 105°C |
| ESR（等效串聯電阻）: | - |
| 描述: | ALU ELECTROLYTIC SMD EXV 25VDC 1 |
| 電容: | 470µF |
| 應用: | Audio, Automotive |
| Email: | [email protected] |
EXV477M025S9PAA的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
EXV477M6R3S9MAA | KEMET | ALU ELECTROLYTIC SMD EXV 6.3VDC | 在線詢價 |
|
EXV477M016S9PAA | KEMET | ALU ELECTROLYTIC SMD EXV 16VDC 1 | 在線詢價 |
|
EXV476M010A9GAA | KEMET | ALU ELECTROLYTIC SMD EXV 10VDC 6 | 在線詢價 |
 |
EXV476M025A9GAA | KEMET | CAP ALUM 47UF 20% 25V SMD | 在線詢價 |
|
EXV477M010A9PAA | KEMET | ALU ELECTROLYTIC SMD EXV 10VDC 1 | 在線詢價 |
|
EXV477M6R3A9MAA | KEMET | ALU ELECTROLYTIC SMD EXV 6.3VDC | 在線詢價 |
|
EXV477M010S9PAA | KEMET | ALU ELECTROLYTIC SMD EXV 10VDC 1 | 在線詢價 |
|
EXV476M010S9GAA | KEMET | ALU ELECTROLYTIC SMD EXV 10VDC 6 | 在線詢價 |
|
EXV476M050S9PAA | KEMET | ALU ELECTROLYTIC SMD EXV 50VDC 1 | 在線詢價 |
 |
EXV477M016A9MAA | KEMET | CAP ALUM 470UF 20% 16V SMD | 在線詢價 |
|
EXV477M016A9PAA | KEMET | ALU ELECTROLYTIC SMD EXV 16VDC 1 | 在線詢價 |
|
EXV475M050S9DAA | KEMET | ALU ELECTROLYTIC SMD EXV 50VDC 5 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers