購買 DS2411X#U與BYCHPS
購買即有保證
DS2411X#U
- 型號:
- DS2411X#U
- 製造商:
- Maxim Integrated
- 描述:
- IC SILICON SER NUMBER FLIPCHIP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18407 Pieces
- 數據表:
- DS2411X#U.pdf
簡單介紹
BYCHIPS是 DS2411X#U的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的DS2411X#U購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Silicon Serial Number |
|---|---|
| 供應商設備封裝: | 4-FlipChip |
| 系列: | - |
| 封装: | Bulk |
| 封裝/箱體: | 4-XFBGA, CSPBGA |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | DS2411X#U |
| 展開說明: | Silicon Serial Number IC PCB, Network Node, Equipment Identification/Registration 4-FlipChip |
| 描述: | IC SILICON SER NUMBER FLIPCHIP |
| 應用: | PCB, Network Node, Equipment Identification/Registration |
| Email: | [email protected] |
DS2411X#U的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
DS2411P+ | Maxim Integrated | IC SILICON SERIAL NUMBER 6-TSOC | 在線詢價 |
|
DS2411P+T&R | Maxim Integrated | IC SILICON SERIAL NUMBER 6TSOC | 在線詢價 |
|
DS2413P+ | Maxim Integrated | IC SWITCH DL ADDRESS 6-TSOC | 在線詢價 |
 |
DS2415X | Maxim Integrated | IC RTC BINARY CNT SER 6-FLIPCHIP | 在線詢價 |
|
DS2413P+T&R | Maxim Integrated | IC SWITCH DL ADDRESS 6TSOC | 在線詢價 |
|
DS2417P/T&R | Maxim Integrated | IC RTC BINARY CNT SER 6-TSOC | 在線詢價 |
 |
DS2413Q+T&R | Maxim Integrated | IC SWITCH 2CH ADDRESS 6-TDFN | 在線詢價 |
 |
DS2417X/T&R | Maxim Integrated | IC RTC BINARY CNT SER 6-FLIPCHIP | 在線詢價 |
|
DS2415P | Maxim Integrated | IC RTC BINARY CNT SER 6-TSOC | 在線詢價 |
 |
DS2411R+T&R | Maxim Integrated | IC SILICON SERIAL NUMBER SOT-23 | 在線詢價 |
|
DS2417P+T&R | Maxim Integrated | IC RTC BINARY CNT SER 6-TSOC | 在線詢價 |
|
DS2411R+U | Maxim Integrated | IC SILICON SERIAL NUMBER SOT-23 | 在線詢價 |
|
DS2415P+T&R | Maxim Integrated | IC RTC BINARY CNT SER 6-TSOC | 在線詢價 |
|
DS2411X | Maxim Integrated | IC SILICON SER NUMBER FLIPCHIP | 在線詢價 |
|
DS2417P+ | Maxim Integrated | IC RTC BINARY CNT SER 6-TSOC | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers