購買 D332Z20Y5VH6UJ5R與BYCHPS
購買即有保證
D332Z20Y5VH6UJ5R
- 型號:
- D332Z20Y5VH6UJ5R
- 描述:
- CAP CER 3300PF 100V Y5V RADIAL
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15331 Pieces
簡單介紹
BYCHIPS是 D332Z20Y5VH6UJ5R的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的D332Z20Y5VH6UJ5R購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 100V |
|---|---|
| 公差: | -20%, +80% |
| 厚度（最大）: | - |
| 溫度係數: | Y5V (F) |
| 尺寸/尺寸: | 0.197" Dia (5.00mm) |
| 系列: | D |
| 評級: | - |
| 封装: | Tape & Box (TB) |
| 封裝/箱體: | Radial, Disc |
| 工作溫度: | -30°C ~ 85°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | D332Z20Y5VH6UJ5R |
| 引線型: | Formed Leads - Kinked |
| 引線間距: | 0.197" (5.00mm) |
| 高度 - 座高（最大）: | - |
| 特徵: | - |
| 失敗率: | - |
| 展開說明: | 3300pF -20%, +80% 100V Ceramic Capacitor Y5V (F) Radial, Disc |
| 描述: | CAP CER 3300PF 100V Y5V RADIAL |
| 電容: | 3300pF |
| 應用: | General Purpose |
| Email: | [email protected] |
D332Z20Y5VH6UJ5R的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
D332Z20Y5VH6UL2R | Vishay BC Components | CAP CER 3300PF 100V Y5V RADIAL | 在線詢價 |
 |
D332Z20Y5VH65J5R | Vishay BC Components | CAP CER 3300PF 100V Y5V RADIAL | 在線詢價 |
|
D332Z20Y5VF63J5R | Vishay BC Components | CAP CER 3300PF 50V Y5V RADIAL | 在線詢價 |
|
D332Z20Y5VH63L2R | Vishay BC Components | CAP CER 3300PF 100V Y5V RADIAL | 在線詢價 |
|
D332Z20Y5VH63J5R | Vishay BC Components | CAP CER 3300PF 100V Y5V RADIAL | 在線詢價 |
|
D332Z20Y5VH6TJ5R | Vishay BC Components | CAP CER 3300PF 100V Y5V RADIAL | 在線詢價 |
|
D332Z20Y5VH65L2R | Vishay BC Components | CAP CER 3300PF 100V Y5V RADIAL | 在線詢價 |
|
D332Z20Y5VF6UJ5R | Vishay BC Components | CAP CER 3300PF 50V Y5V RADIAL | 在線詢價 |
|
D332Z20Y5VF6TJ5R | Vishay BC Components | CAP CER 3300PF 50V Y5V RADIAL | 在線詢價 |
|
D332Z20Y5VH6TL2R | Vishay BC Components | CAP CER 3300PF 100V Y5V RADIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers