購買 CPC5620A與BYCHPS
購買即有保證
CPC5620A
- 型號:
- CPC5620A
- 描述:
- IC LITELINK III HALF RING 32SOIC
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14384 Pieces
- 數據表:
- CPC5620A.pdf
簡單介紹
BYCHIPS是 CPC5620A的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CPC5620A購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 3 V ~ 5.5 V |
|---|---|
| 供應商設備封裝: | 32-SOIC |
| 系列: | LITELINK® III |
| 功率（瓦特）: | 1W |
| 封装: | Tube |
| 封裝/箱體: | 32-SOIC (0.295", 7.50mm Width) |
| 其他名稱: | CLA166 |
| 工作溫度: | -40°C ~ 85°C |
| 電路數: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 7 Weeks |
| 製造商零件編號: | CPC5620A |
| 接口: | - |
| 包括: | Caller ID Signal Reception Function, Half-Wave Ring Detection |
| 功能: | Data Access Arrangement (DAA) |
| 展開說明: | Telecom IC Data Access Arrangement (DAA) 32-SOIC |
| 描述: | IC LITELINK III HALF RING 32SOIC |
| 供電: | 9mA |
| Email: | [email protected] |
CPC5620A的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers