購買 CL31F104ZACNBND與BYCHPS
購買即有保證
CL31F104ZACNBND
- 型號:
- CL31F104ZACNBND
- 描述:
- CAP ARRAY 0.1UF 25V Y5V 1206
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15627 Pieces
簡單介紹
BYCHIPS是 CL31F104ZACNBND的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CL31F104ZACNBND購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 25V |
|---|---|
| 公差: | -20%, +80% |
| 溫度係數: | Y5V (F) |
| 尺寸/尺寸: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| 系列: | CL |
| 評級: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 1206 (3216 Metric) |
| 電容器數: | 4 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | CL31F104ZACNBND |
| 高度 - 座高（最大）: | 0.039" (1.00mm) |
| 展開說明: | 0.1µF -20%, +80% Isolated Capacitor Array 25V Y5V (F) 1206 (3216 Metric) |
| 絕緣材料: | Ceramic |
| 描述: | CAP ARRAY 0.1UF 25V Y5V 1206 |
| 電路類型: | Isolated |
| 電容: | 0.1µF |
| Email: | [email protected] |
CL31F104ZACNBND的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers