購買 CB037E0104KBA與BYCHPS
購買即有保證
CB037E0104KBA
- 型號:
- CB037E0104KBA
- 製造商:
- AVX Corporation
- 描述:
- CAP FILM 0.1UF 10% 100VDC 1812
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16672 Pieces
簡單介紹
BYCHIPS是 CB037E0104KBA的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CB037E0104KBA購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓 - 直流: | 100V |
|---|---|
| 額定電壓 - AC: | 63V |
| 公差: | ±10% |
| 終止: | Solder Pads |
| 尺寸/尺寸: | 0.185" L x 0.126" W (4.70mm x 3.20mm) |
| 系列: | CB |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 1812 (4532 Metric) |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 29 Weeks |
| 製造商零件編號: | CB037E0104KBA |
| 引線間距: | - |
| 高度 - 座高（最大）: | 0.118" (3.00mm) |
| 特徵: | - |
| 展開說明: | 0.1µF ±10% Film Capacitor 63V 100V Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked 1812 (4532 Metric) |
| ESR（等效串聯電阻）: | - |
| 絕緣材料: | Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked |
| 描述: | CAP FILM 0.1UF 10% 100VDC 1812 |
| 電容: | 0.1µF |
| 應用: | General Purpose |
| Email: | [email protected] |
CB037E0104KBA的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
CB037E0104JBA | AVX Corporation | CAP FILM 0.1UF 5% 100VDC 1812 | 在線詢價 |
|
CB037E0473JBA | AVX Corporation | CAP FILM 0.047UF 5% 100VDC 1812 | 在線詢價 |
|
CB037D0154KBC | AVX Corporation | CAP FILM 0.15UF 10% 63VDC 1812 | 在線詢價 |
|
CB037E0333KBA | AVX Corporation | CAP FILM 0.033UF 10% 100VDC 1812 | 在線詢價 |
|
CB037E0153JBA | AVX Corporation | CAP FILM 0.015UF 5% 100VDC 1812 | 在線詢價 |
|
CB037G0472JBA | AVX Corporation | CAP FILM 4700PF 5% 250VDC 1812 | 在線詢價 |
|
CB037D0104JBA | AVX Corporation | CAP FILM 0.1UF 5% 63VDC 1812 | 在線詢價 |
|
CB037D0103JBA | AVX Corporation | CAP FILM 10000PF 5% 63VDC 1812 | 在線詢價 |
|
CB037E0333JBA | AVX Corporation | CAP FILM 0.033UF 5% 100VDC 1812 | 在線詢價 |
|
CB037D0224KBA | AVX Corporation | CAP FILM 0.22UF 10% 63VDC 1812 | 在線詢價 |
|
CB037D0104KBA | AVX Corporation | CAP FILM 0.1UF 10% 63VDC 1812 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers