購買 B41789K5188Q001與BYCHPS
購買即有保證
B41789K5188Q001
- 型號:
- B41789K5188Q001
- 製造商:
- EPCOS
- 描述:
- CAP ALUM 1800UF 25V RADIAL
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16403 Pieces
簡單介紹
BYCHIPS是 B41789K5188Q001的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的B41789K5188Q001購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 25V |
|---|---|
| 公差: | -10%, +30% |
| 表面貼裝佔地面積: | - |
| 尺寸/尺寸: | 0.630" Dia (16.00mm) |
| 系列: | B41789 |
| 紋波電流: | 5.9A @ 10kHz |
| 極化: | Polar |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Can |
| 其他名稱: | B41789K5188Q1 |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | B41789K5188Q001 |
| 壽命@溫度。: | 10000 Hrs @ 125°C |
| 引線間距: | 0.650" (16.50mm) |
| 阻抗: | 28 mOhm |
| 高度 - 座高（最大）: | 1.614" (41.00mm) |
| 展開說明: | 1800µF 25V Aluminum Capacitors Radial, Can 55 mOhm @ 100Hz 10000 Hrs @ 125°C |
| ESR（等效串聯電阻）: | 55 mOhm @ 100Hz |
| 描述: | CAP ALUM 1800UF 25V RADIAL |
| 電容: | 1800µF |
| 應用: | Automotive |
| Email: | [email protected] |
B41789K5188Q001的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
B41789K5158Q001 | EPCOS (TDK) | CAP ALUM 1500UF 25V RADIAL | 在線詢價 |
|
B41789K8277Q001 | EPCOS (TDK) | CAP ALUM 270UF 63V RADIAL | 在線詢價 |
|
B41789K5138Q001 | EPCOS (TDK) | CAP ALUM 1300UF 25V RADIAL | 在線詢價 |
|
B41789K5228Q001 | EPCOS (TDK) | CAP ALUM 2200UF 25V RADIAL | 在線詢價 |
|
B41789K5108Q001 | EPCOS (TDK) | CAP ALUM 1000UF 25V RADIAL | 在線詢價 |
|
B41789K5128Q001 | EPCOS (TDK) | CAP ALUM 1200UF 25V RADIAL | 在線詢價 |
|
B41789K5338Q001 | EPCOS (TDK) | CAP ALUM 3300UF 25V RADIAL | 在線詢價 |
|
B41789A8567Q001 | EPCOS (TDK) | CAP ALUM 560UF 63V RADIAL | 在線詢價 |
|
B41789A7108Q001 | EPCOS (TDK) | CAP ALUM 1000UF 40V RADIAL | 在線詢價 |
|
B41789A7827Q001 | EPCOS (TDK) | CAP ALUM 820UF 40V RADIAL | 在線詢價 |
|
B41789K5178Q001 | EPCOS (TDK) | CAP ALUM 1700UF 25V RADIAL | 在線詢價 |
|
B41789K8477Q001 | EPCOS (TDK) | CAP ALUM 470UF 63V RADIAL | 在線詢價 |
|
B41789K5458Q001 | EPCOS (TDK) | CAP ALUM 4500UF 25V RADIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers