購買 B32656S7564K562與BYCHPS
購買即有保證
B32656S7564K562
- 型號:
- B32656S7564K562
- 製造商:
- EPCOS
- 描述:
- CAP FILM 0.56UF 1.25KVDC SCREW
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19018 Pieces
簡單介紹
BYCHIPS是 B32656S7564K562的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的B32656S7564K562購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓 - 直流: | 1250V (1.25kV) |
|---|---|
| 額定電壓 - AC: | 500V |
| 公差: | ±10% |
| 終止: | Screw Terminals |
| 尺寸/尺寸: | 1.654" L x 0.787" W (42.00mm x 20.00mm) |
| 系列: | B32656S |
| 封装: | Bulk |
| 封裝/箱體: | Rectangular Box |
| 其他名稱: | Q3971856 |
| 工作溫度: | -55°C ~ 100°C |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | B32656S7564K562 |
| 引線間距: | 0.965" (24.50mm) |
| 高度 - 座高（最大）: | 1.555" (39.50mm) |
| 特徵: | Low ESL |
| 展開說明: | 0.56µF ±10% Film Capacitor 500V 1250V (1.25kV) Polypropylene (PP), Metallized Rectangular Box |
| ESR（等效串聯電阻）: | 7 mOhm |
| 絕緣材料: | Polypropylene (PP), Metallized |
| 描述: | CAP FILM 0.56UF 1.25KVDC SCREW |
| 電容: | 0.56µF |
| 應用: | Snubber |
| Email: | [email protected] |
B32656S7564K562的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
B32656S7564K561 | EPCOS (TDK) | CAP FILM 0.56UF 1.25KVDC SCREW | 在線詢價 |
 |
B32656S7564K566 | EPCOS (TDK) | CAP FILM 0.56UF 1.25KVDC QC TERM | 在線詢價 |
|
B32656S7105K577 | EPCOS (TDK) | CAP FILM 1UF 10% 1.25KVDC QC TRM | 在線詢價 |
|
B32656S7105J561 | EPCOS (TDK) | CAP FILM 1UF 5% 1.25KVDC SCREW | 在線詢價 |
|
B32656S7224K565 | EPCOS (TDK) | CAP FILM 0.22UF 1.25KVDC SCREW | 在線詢價 |
|
B32656S7684K566 | EPCOS (TDK) | CAP FILM 0.68UF 1.25KVDC QC TERM | 在線詢價 |
|
B32656S7334K565 | EPCOS (TDK) | CAP FILM 0.33UF 1.25KVDC SCREW | 在線詢價 |
|
B32656S7224K563 | EPCOS (TDK) | CAP FILM 0.22UF 1.25KVDC SCREW | 在線詢價 |
|
B32656S7125K563 | EPCOS (TDK) | CAP FILM 1.2UF 1.25KVDC QC TERM | 在線詢價 |
 |
B32656S7105K563 | EPCOS (TDK) | CAP FILM 1UF 10% 1.25KVDC SCREW | 在線詢價 |
|
B32656S7684K562 | EPCOS (TDK) | CAP FILM 0.68UF 1.25KVDC SCREW | 在線詢價 |
 |
B32656S7105K561 | EPCOS (TDK) | CAP FILM 1UF 10% 1.25KVDC SCREW | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog