購買 B32560J8332J189與BYCHPS
購買即有保證
B32560J8332J189
- 型號:
- B32560J8332J189
- 製造商:
- EPCOS
- 描述:
- CAP FILM 3300PF 5% 630VDC 2DIP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16240 Pieces
簡單介紹
BYCHIPS是 B32560J8332J189的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的B32560J8332J189購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓 - 直流: | 630V |
|---|---|
| 額定電壓 - AC: | 400V |
| 公差: | ±5% |
| 終止: | PC Pins |
| 尺寸/尺寸: | 0.354" L x 0.098" W (9.00mm x 2.50mm) |
| 系列: | SilverCap™ B32560 |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 2-DIP |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | B32560J8332J189 |
| 引線間距: | 0.295" (7.50mm) |
| 高度 - 座高（最大）: | 0.217" (5.50mm) |
| 特徵: | - |
| 展開說明: | 3300pF ±5% Film Capacitor 400V 630V Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked 2-DIP |
| ESR（等效串聯電阻）: | - |
| 絕緣材料: | Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked |
| 描述: | CAP FILM 3300PF 5% 630VDC 2DIP |
| 電容: | 3300pF |
| 應用: | General Purpose |
| Email: | [email protected] |
B32560J8332J189的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
B32560J8332J | EPCOS (TDK) | CAP FILM 3300PF 5% 630VDC 2DIP | 在線詢價 |
|
B32560J8472K289 | EPCOS (TDK) | CAP FILM 4700PF 10% 630VDC 2DIP | 在線詢價 |
|
B32560J8472K | EPCOS (TDK) | CAP FILM 4700PF 10% 630VDC 2DIP | 在線詢價 |
|
B32560J8332K | EPCOS (TDK) | CAP FILM 3300PF 10% 630VDC 2DIP | 在線詢價 |
 |
B32560J8153K000 | EPCOS (TDK) | CAP FILM 0.015UF 10% 630VDC 2DIP | 在線詢價 |
|
B32560J8102K | EPCOS (TDK) | CAP FILM 1000PF 10% 630VDC 2DIP | 在線詢價 |
|
B32560J8332K189 | EPCOS (TDK) | CAP FILM 3300PF 10% 630VDC 2DIP | 在線詢價 |
|
B32560J8102K189 | EPCOS (TDK) | CAP FILM 1000PF 10% 630VDC 2DIP | 在線詢價 |
|
B32560J8272K289 | EPCOS (TDK) | CAP FILM 2700PF 10% 630VDC 2DIP | 在線詢價 |
|
B32560J8332K289 | EPCOS (TDK) | CAP FILM 3300PF 10% 630VDC 2DIP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers