購買 AUIRFS3004TRL與BYCHPS
購買即有保證
AUIRFS3004TRL
- 型號:
- AUIRFS3004TRL
- 描述:
- MOSFET N-CH 40V 340A D2PAK
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14259 Pieces
簡單介紹
BYCHIPS是 AUIRFS3004TRL的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的AUIRFS3004TRL購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| VGS（TH）（最大）@標識: | 4V @ 250µA |
|---|---|
| 技術: | MOSFET (Metal Oxide) |
| 供應商設備封裝: | D-PAK (TO-252AA) |
| 系列: | HEXFET® |
| RDS（ON）（最大值）@標識，柵極電壓: | 1.75 mOhm @ 195A, 10V |
| 功率耗散（最大）: | 380W (Tc) |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| 其他名稱: | SP001517570 |
| 工作溫度: | -55°C ~ 175°C (TJ) |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 11 Weeks |
| 製造商零件編號: | AUIRFS3004TRL |
| 輸入電容（Ciss）（Max）@ Vds: | 9200pF @ 25V |
| 柵極電荷（Qg）（Max）@ Vgs: | 240nC @ 10V |
| FET型: | N-Channel |
| FET特點: | - |
| 展開說明: | N-Channel 40V 195A (Tc) 380W (Tc) Surface Mount D-PAK (TO-252AA) |
| 漏極至源極電壓（Vdss）: | 40V |
| 描述: | MOSFET N-CH 40V 340A D2PAK |
| 電流 - 25°C連續排水（Id）: | 195A (Tc) |
| Email: | [email protected] |
AUIRFS3004TRL的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
AUIRFS3107TRL | Infineon Technologies | MOSFET N-CH 75V 230A D2PAK | 在線詢價 |
 |
AUIRFS3004-7TRL | Infineon Technologies | MOSFET N-CH 40V 240A D2PAK-7P | 在線詢價 |
|
AUIRFS3006 | Infineon Technologies | MOSFET N-CH 60V 270A D2PAK | 在線詢價 |
 |
AUIRFS3004 | Infineon Technologies | MOSFET N-CH 40V 340A D2PAK | 在線詢價 |
|
AUIRFS3004-7P | Infineon Technologies | MOSFET N-CH 40V 240A D2PAK-7P | 在線詢價 |
|
AUIRFS3607TRL | Infineon Technologies | MOSFET N-CH 75V 80A D2PAK | 在線詢價 |
|
AUIRFS3306TRL | Infineon Technologies | MOSFET N-CH 60V 160A D2PAK | 在線詢價 |
|
AUIRFS3006-7P | Infineon Technologies | MOSFET N-CH 60V 293A D2PAK-7P | 在線詢價 |
|
AUIRFS3206TRL | Infineon Technologies | MOSFET N-CH 60V 210A D2PAK | 在線詢價 |
|
AUIRFS3107 | Infineon Technologies | MOSFET N-CH 75V 230A D2PAK | 在線詢價 |
|
AUIRFS3206 | Infineon Technologies | MOSFET N-CH 60V 210A D2PAK | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers