繁体版
English
Deutsch
Français
русский
español
Português
日本語
Italia
한국의
العربية
Türk dili
polski
Suomi
Indonesia
Tiếng Việt
ภาษาไทย
Nederland
Pilipino
Čeština
繁体中文
Magyarország
Kongeriket
Dansk
Svenska
✕
關於我們
|
聯繫我們
|
在線詢價
|
首 頁
關於Bychips
產品展示
製造商
要求報價
新聞媒體
聯繫Bychips
首 頁
>
產品展示
>
繼電器
>
信號繼電器,高達2安培
>
ARS16A03
ARS16A03
型號:
ARS16A03
製造商:
Panasonic
描述:
ARS RELAY 1 FORM C 3V
無鉛狀態/ RoHS狀態:
無鉛/符合RoHS
庫存數量:
17356 Pieces
數據表:
ARS16A03.pdf
在線詢價
簡單介紹
BYCHIPS是
ARS16A03的现货代理商,我們有庫存立即運輸,也可供長時間供應。請寄給我們您的
ARS16A03
購買計劃
通過電子郵件,我們會根據您的計劃給您最優惠的價格。
購買
ARS16A03與BYCHPS
購買即有保證
產品特性
系列:
*
濕度敏感度(MSL):
4 (72 Hours)
製造商標準交貨期:
11 Weeks
製造商零件編號:
ARS16A03
展開說明:
Relay
描述:
ARS RELAY 1 FORM C 3V
Email:
[email protected]
快速詢價
型號
數量
公司
邮箱
電話
要求
ARS16A03
的相似型號
圖片
型號
製造商
描述
查看
ARS16Y09
Panasonic Electric Works
ARS RELAY
在線詢價
ARS16Y4HX
Panasonic Electric Works
ARS MICROWAVE RELAY 3GHZ
在線詢價
1-1462038-0
TE Connectivity Potter & Brumfield Relays
RELAY TELECOM DPDT 2A 1.5V
在線詢價
ARS16Y12
Panasonic Electric Works
RS RELAY 1FORMC 2 COIL LATCHING
在線詢價
ARS16Y03Z
Panasonic Electric Works
ARS MICROWAVE RELAY 3GHZ
在線詢價
ARS16Y03
Panasonic Electric Works
ARS MICROWAVE RELAY 3GHZ
在線詢價
ARS16Y4H
Panasonic Electric Works
ARS RELAY 1 FORM C 4.5V
在線詢價
ARS16A03X
Panasonic Electric Works
ARS RELAY 1 FORM C 3V
在線詢價
ARS1609
Panasonic Electric Works
RS RELAY 1FORMC 2 COIL LATCHING
在線詢價
ARS16A12
Panasonic Electric Works
RELAY RF SPDT 500MA 12V
在線詢價
ARS16A09
Panasonic Electric Works
RS RELAY 1FORMC 2 COIL LATCHING
在線詢價
TXS2SA-L2-4.5V
Panasonic Electric Works
RELAY GEN PURPOSE DPDT 1A 4.5V
在線詢價
ARS164H
Panasonic Electric Works
ARS (RS) HIGH FREQUENCY RELAY
在線詢價
ARS16Y03X
Panasonic Electric Works
ARS MICROWAVE RELAY 3GHZ
在線詢價
5-1393817-5
TE Connectivity Potter & Brumfield Relays
RELAY GEN PURP
在線詢價
ARS16Y4HZ
Panasonic Electric Works
ARS MICROWAVE RELAY 3GHZ
在線詢價
ARS16A4H
Panasonic Electric Works
ARS (RS) HIGH FREQUENCY RELAY
在線詢價
ARS1612
Panasonic Electric Works
RELAY RF SPDT 500MA 12V
在線詢價
最新資訊
Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
Janet Clark to join TI board of directors
TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
GCHQ Director calls for international cyber pact
Embedded World: Arm introduces fourth security element to PSA
Last chance: Nominate BrightSparks before 28 February
Embedded World 2019: Get the full Electronics Weekly Guide
"Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers