購買 865060657011與BYCHPS
購買即有保證
865060657011
- 型號:
- 865060657011
- 描述:
- CAP 150 UF 20% 50 V
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15877 Pieces
- 數據表:
- 865060657011.pdf
簡單介紹
BYCHIPS是 865060657011的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的865060657011購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 50V |
|---|---|
| 公差: | ±20% |
| 表面貼裝佔地面積: | 0.406" L x 0.406" W (10.30mm x 10.30mm) |
| 尺寸/尺寸: | 0.394" Dia (10.00mm) |
| 系列: | WCAP-ASLL |
| 紋波電流: | 555mA @ 100kHz |
| 極化: | Polar |
| 封装: | Original-Reel® |
| 封裝/箱體: | Radial, Can - SMD |
| 其他名稱: | 732-8551-6 |
| 工作溫度: | -55°C ~ 105°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 12 Weeks |
| 製造商零件編號: | 865060657011 |
| 壽命@溫度。: | 5000 Hrs @ 105°C |
| 引線間距: | - |
| 阻抗: | 250 mOhm |
| 高度 - 座高（最大）: | 0.413" (10.50mm) |
| 展開說明: | 150µF 50V Aluminum Capacitors Radial, Can - SMD 5000 Hrs @ 105°C |
| ESR（等效串聯電阻）: | - |
| 描述: | CAP 150 UF 20% 50 V |
| 電容: | 150µF |
| 應用: | General Purpose |
| Email: | [email protected] |
865060657011的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
865060653010 | Wurth Electronics Inc. | CAP 100 UF 20% 50 V | 在線詢價 |
|
865060640001 | Wurth Electronics Inc. | CAP 1 UF 20% 50 V | 在線詢價 |
|
865060657012 | Wurth Electronics Inc. | CAP 220 UF 20% 50 V | 在線詢價 |
|
865060642004 | Wurth Electronics Inc. | CAP 4.7 UF 20% 50 V | 在線詢價 |
|
865060663014 | Wurth Electronics Inc. | CAP 680 UF 20% 50 V | 在線詢價 |
|
865060653009 | Wurth Electronics Inc. | CAP 68 UF 20% 50 V | 在線詢價 |
|
865060663013 | Wurth Electronics Inc. | CAP 470 UF 20% 50 V | 在線詢價 |
|
865060663015 | Wurth Electronics Inc. | CAP 1000 UF 20% 50 V | 在線詢價 |
|
865060640003 | Wurth Electronics Inc. | CAP 3.3 UF 20% 50 V | 在線詢價 |
|
865060645008 | Wurth Electronics Inc. | CAP 47 UF 20% 50 V | 在線詢價 |
|
865060640002 | Wurth Electronics Inc. | CAP 2.2 UF 20% 50 V | 在線詢價 |
|
865060643005 | Wurth Electronics Inc. | CAP 10 UF 20% 50 V | 在線詢價 |
|
865060645007 | Wurth Electronics Inc. | CAP 33 UF 20% 50 V | 在線詢價 |
|
865060643006 | Wurth Electronics Inc. | CAP 22 UF 20% 50 V | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers