購買 74ALVT16373DGG,118與BYCHPS
購買即有保證
74ALVT16373DGG,118
- 型號:
- 74ALVT16373DGG,118
- 製造商:
- Nexperia
- 描述:
- IC 16BIT TRANSP D LATCH 48TSSOP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18925 Pieces
簡單介紹
BYCHIPS是 74ALVT16373DGG,118的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的74ALVT16373DGG,118購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 2.3 V ~ 2.7 V, 3 V ~ 3.6 V |
|---|---|
| 供應商設備封裝: | 48-TSSOP |
| 系列: | 74ALVT |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 48-TFSOP (0.240", 6.10mm Width) |
| 輸出類型: | Tri-State |
| 其他名稱: | 1727-6567-2 568-8840-2 568-8840-2-ND 74ALVT16373DGG,118-ND 74ALVT16373DGG118 935209640118 |
| 工作溫度: | -40°C ~ 85°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | 74ALVT16373DGG,118 |
| 邏輯類型: | D-Type Transparent Latch |
| 獨立電路: | 2 |
| 展開說明: | D-Type Transparent Latch Channel 8:8 IC Tri-State 48-TSSOP |
| 描述: | IC 16BIT TRANSP D LATCH 48TSSOP |
| 延遲時間 - 傳輸: | 2ns |
| 電流 - 輸出高，低: | 8mA, 24mA; 32mA, 64mA |
| 電路: | 8:8 |
| Email: | [email protected] |
74ALVT16373DGG,118的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
74ALVT16373DL,112 | Nexperia USA Inc. | IC 16BIT TRANSP D LATCH 48SSOP | 在線詢價 |
 |
74ALVT16373DGG,518 | Nexperia USA Inc. | IC 16BIT TRANSP D LATCH 48TSSOP | 在線詢價 |
|
74ALVT16374DGG,118 | Nexperia USA Inc. | IC D-TYPE POS TRG DUAL 48TSSOP | 在線詢價 |
|
74ALVT16244DGG,518 | Nexperia USA Inc. | IC BUFF DVR TRI-ST 16BIT 48TSSOP | 在線詢價 |
 |
74ALVT16821DL,518 | Nexperia USA Inc. | IC D-TYPE POS TRG DUAL 56SSOP | 在線詢價 |
|
74ALVT16373DL,118 | Nexperia USA Inc. | IC 16BIT TRANSP D LATCH 48SSOP | 在線詢價 |
|
74ALVT16373DGG,112 | Nexperia USA Inc. | IC 16BIT TRANSP D LATCH 48TSSOP | 在線詢價 |
|
74ALVT16827DL,512 | Nexperia USA Inc. | IC BUFF DVR TRI-ST 20BIT 56SSOP | 在線詢價 |
|
74ALVT16823DGG,112 | Nexperia USA Inc. | IC D-TYPE POS TRG DUAL 56TSSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers