購買 74438336022與BYCHPS
購買即有保證
74438336022
- 型號:
- 74438336022
- 描述:
- FIXED IND 2.2UH 2.4A 80 MOHM SMD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18193 Pieces
- 數據表:
- 74438336022.pdf
簡單介紹
BYCHIPS是 74438336022的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的74438336022購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Molded |
|---|---|
| 公差: | ±20% |
| 供應商設備封裝: | 3020 |
| 尺寸/尺寸: | 0.118" L x 0.118" W (3.00mm x 3.00mm) |
| 屏蔽: | Shielded |
| 系列: | WE-MAPI |
| 評級: | - |
| Q因子@頻率: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 2-SMD |
| 其他名稱: | 732-5696-2 |
| 工作溫度: | -40°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料 - 核: | Metal Composite |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | 74438336022 |
| 電感: | 2.2µH |
| 高度 - 座高（最大）: | 0.079" (2.00mm) |
| 頻率 - 測試: | 100kHz |
| 頻率 - 自諧振: | 42MHz |
| 展開說明: | 2.2µH Shielded Molded Inductor 2.4A 80 mOhm Max 2-SMD |
| 描述: | FIXED IND 2.2UH 2.4A 80 MOHM SMD |
| 直流電阻（DCR）: | 80 mOhm Max |
| 目前評級: | 2.4A |
| 電流 - 飽和: | 4.3A |
| Email: | [email protected] |
74438336022的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
744383360047 | Wurth Electronics Inc. | FIXED IND 470NH 4.8A 22 MOHM SMD | 在線詢價 |
|
74438336015 | Wurth Electronics Inc. | FIXED IND 1.5UH 3.7A 39 MOHM SMD | 在線詢價 |
|
74438336047 | Wurth Electronics Inc. | FIXED IND 4.7UH 1.9A 158 MOHM | 在線詢價 |
|
74438336010 | Wurth Electronics Inc. | FIXED IND 1UH 4A 32 MOHM SMD | 在線詢價 |
|
74438336012 | Wurth Electronics Inc. | FIXED IND 1.2UH 3.9A 36 MOHM SMD | 在線詢價 |
|
74438336068 | Wurth Electronics Inc. | FIXED IND 6.8UH 1.6A 193 MOHM | 在線詢價 |
|
744383360033 | Wurth Electronics Inc. | FIXED IND 330NH 5.5A 17 MOHM SMD | 在線詢價 |
|
74438336033 | Wurth Electronics Inc. | FIXED IND 3.3UH 2.2A 114 MOHM | 在線詢價 |
|
744383360068 | Wurth Electronics Inc. | FIXED IND 680NH 4.5A 27 MOHM SMD | 在線詢價 |
|
74438336100 | Wurth Electronics Inc. | FIXED IND 10UH 1.2A 322 MOHM SMD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers