購買 7427226與BYCHPS
購買即有保證
7427226
- 型號:
- 7427226
- 描述:
- FERRITE CORE 75 OHM SOLID
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18606 Pieces
- 數據表:
- 7427226.pdf
簡單介紹
BYCHIPS是 7427226的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的7427226購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Flat |
|---|---|
| 系列: | WE-FLAT |
| 評級: | - |
| 外部尺寸: | 0.937" W x 0.248" H (23.80mm x 6.30mm) |
| 其他名稱: | 732-2396 7427226-ND Q4214595 |
| 安裝類型: | Free Hanging |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料: | 4W620 |
| 製造商標準交貨期: | 14 Weeks |
| 製造商零件編號: | 7427226 |
| 長度: | 0.472" (12.00mm) |
| 內在維度: | 0.740" W x 0.043" H (18.80mm x 1.10mm) |
| 頻率對應阻抗: | 75 Ohm @ 100MHz |
| 展開說明: | Solid Free Hanging Ferrite Core 75 Ohm @ 100MHz ID 0.740" W x 0.043" H (18.80mm x 1.10mm) OD 0.937" W x 0.248" H (23.80mm x 6.30mm) Length 0.472" (12.00mm) |
| 設計: | Solid |
| 描述: | FERRITE CORE 75 OHM SOLID |
| Email: | [email protected] |
7427226的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
7427247 | Wurth Electronics Inc. | FERRITE CORE 192 OHM HINGED | 在線詢價 |
 |
7427246 | Wurth Electronics Inc. | FERRITE CORE 194 OHM HINGED | 在線詢價 |
 |
7427227 | Wurth Electronics Inc. | FERRITE CORE 44 OHM SOLID | 在線詢價 |
 |
7427248 | Wurth Electronics Inc. | FERRITE CORE 180 OHM HINGED | 在線詢價 |
 |
7427224 | Wurth Electronics Inc. | FERRITE CORE 115 OHM SOLID | 在線詢價 |
 |
7427218 | Wurth Electronics Inc. | FERRITE CORE 66 OHM SOLID | 在線詢價 |
 |
7427220 | Wurth Electronics Inc. | FERRITE CORE 90 OHM SOLID | 在線詢價 |
 |
74272475 | Wurth Electronics Inc. | FERRITE CORE 114 OHM HINGED | 在線詢價 |
 |
7427223 | Wurth Electronics Inc. | FERRITE CORE 48 OHM SOLID | 在線詢價 |
 |
74272733 | Wurth Electronics Inc. | FERRITE CORE 62 OHM HINGED 8MM | 在線詢價 |
 |
7427221 | Wurth Electronics Inc. | FERRITE CORE 166 OHM SOLID | 在線詢價 |
 |
7427228 | Wurth Electronics Inc. | FERRITE CORE 80 OHM SOLID | 在線詢價 |
 |
7427216 | Wurth Electronics Inc. | FERRITE CORE 63 OHM SOLID | 在線詢價 |
 |
74272722 | Wurth Electronics Inc. | FERRITE CORE 40 OHM HINGED | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers