購買 72605L50PF與BYCHPS
購買即有保證
72605L50PF
- 型號:
- 72605L50PF
- 描述:
- IC FIFO BI SYNC 256X18 64-TQFP
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 18809 Pieces
簡單介紹
BYCHIPS是 72605L50PF的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的72605L50PF購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 4.5 V ~ 5.5 V |
|---|---|
| 供應商設備封裝: | 64-TQFP (14x14) |
| 系列: | 7200 |
| 重傳功能: | No |
| 可編程標誌支持: | Yes |
| 封装: | Tray |
| 封裝/箱體: | 64-LQFP |
| 其他名稱: | IDT72605L50PF IDT72605L50PF-ND |
| 工作溫度: | 0°C ~ 70°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 內存大小: | 9K (256 x 18 x 2) |
| 製造商零件編號: | 72605L50PF |
| 功能: | Synchronous |
| FWFT支持: | No |
| 擴展類型: | Width |
| 描述: | IC FIFO BI SYNC 256X18 64-TQFP |
| 數據速率: | 20MHz |
| 電流 - 電源（最大）: | 230mA |
| 公交車方向: | Bi-Directional |
| 訪問時間: | 25ns |
| Email: | [email protected] |
72605L50PF的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers