購買 70W3270-13與BYCHPS
購買即有保證
70W3270-13
- 型號:
- 70W3270-13
- 製造商:
- Grayhill, Inc.
- 描述:
- BRACKET HOLD DOWN 8PS
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12762 Pieces
- 數據表:
- 70W3270-13.pdf
簡單介紹
BYCHIPS是 70W3270-13的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的70W3270-13購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 產品規格: | - |
|---|---|
| 系列: | - |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | 70W3270-13 |
| 適用於/相關產品: | - |
| 展開說明: | BRACKET HOLD DOWN 8PS |
| 描述: | BRACKET HOLD DOWN 8PS |
| 顏色: | - |
| 附件類型: | - |
| Email: | [email protected] |
70W3270-13的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
70W3270-12 | Grayhill Inc. | BRACKET HOLD DOWN 12PS | 在線詢價 |
|
70W3270-11 | Grayhill Inc. | BRACKET HOLD DOWN 16PS | 在線詢價 |
|
70W3270-14 | Grayhill Inc. | BRACKET HOLD DOWN 24PS | 在線詢價 |
 |
HS-1 | Crydom Co. | HEATSINK FOR SSR 0-10A 3.3"X4.1" | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers