購買 4600-063與BYCHPS
購買即有保證
4600-063
- 型號:
- 4600-063
- 描述:
- CAP FEEDTHRU 1.4UF 70V AXIAL
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 17885 Pieces
- 數據表:
- 4600-063.pdf
簡單介紹
BYCHIPS是 4600-063的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的4600-063購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 70V |
|---|---|
| 公差: | - |
| 螺紋尺寸: | 1/4-28 |
| 溫度係數: | - |
| 尺寸/尺寸: | 0.385" Dia x 0.362" L (9.78mm x 9.20mm) |
| 系列: | 4600 |
| 評級: | - |
| 封装: | Bulk |
| 封裝/箱體: | Axial, Bushing |
| 工作溫度: | - |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | 4600-063 |
| 插入損耗: | - |
| 高度（最大）: | - |
| 展開說明: | 1.4µF Feed Through Capacitor 70V 25A Axial, Bushing |
| 描述: | CAP FEEDTHRU 1.4UF 70V AXIAL |
| 直流電阻（DCR）（最大值）: | - |
| 當前: | 25A |
| 電容: | 1.4µF |
| Email: | [email protected] |
4600-063的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers