購買 450LSU4700MEFC77X141與BYCHPS
購買即有保證
450LSU4700MEFC77X141
- 型號:
- 450LSU4700MEFC77X141
- 製造商:
- Rubycon
- 描述:
- CAP ALUM 4700UF 20% 450V SCREW
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18893 Pieces
簡單介紹
BYCHIPS是 450LSU4700MEFC77X141的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的450LSU4700MEFC77X141購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 450V |
|---|---|
| 公差: | ±20% |
| 表面貼裝佔地面積: | - |
| 尺寸/尺寸: | 3.032" Dia (77.00mm) |
| 系列: | LSU |
| 紋波電流: | 17A |
| 極化: | Polar |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Can - Screw Terminals |
| 工作溫度: | -25°C ~ 85°C |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | 450LSU4700MEFC77X141 |
| 壽命@溫度。: | 5000 Hrs @ 85°C |
| 引線間距: | 1.236" (31.40mm) |
| 阻抗: | - |
| 高度 - 座高（最大）: | 5.630" (143.00mm) |
| 展開說明: | 4700µF 450V Aluminum Capacitors Radial, Can - Screw Terminals 5000 Hrs @ 85°C |
| ESR（等效串聯電阻）: | - |
| 描述: | CAP ALUM 4700UF 20% 450V SCREW |
| 電容: | 4700µF |
| 應用: | General Purpose |
| Email: | [email protected] |
450LSU4700MEFC77X141的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
450LSU4700MNB77X141 | Rubycon | CAP ALUM 4700UF 20% 450V SCREW | 在線詢價 |
 |
450LSU3300M64X149 | Rubycon | SCREW TERMINAL | 在線詢價 |
|
450LSU6800M77X144 | Rubycon | SCREW TERMINAL | 在線詢價 |
|
450LSU4700M64X189 | Rubycon | SCREW TERMINAL | 在線詢價 |
|
450LSU10000M90X161 | Rubycon | SCREW TERMINAL | 在線詢價 |
|
450LSU4700M77X143 | Rubycon | SCREW TERMINAL | 在線詢價 |
|
450LSU1500M51X106 | Rubycon | SCREW TERMINAL | 在線詢價 |
 |
450LSU5600MNB77X151 | Rubycon | CAP ALUM 5600UF 20% 450V SCREW | 在線詢價 |
 |
450LSU6800MNB77X191 | Rubycon | CAP ALUM 6800UF 20% 450V SCREW | 在線詢價 |
|
450LSU6800M90X141 | Rubycon | SCREW TERMINAL | 在線詢價 |
|
450LSU3300M77X86 | Rubycon | SCREW TERMINAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers